Basic RF characteristics of the microstrip line employing periodically perforated ground metal and its application to highly miniaturized on-chip passive components on GaAs MMIC

被引:19
作者
Yun, Young [1 ]
Lee, Kyung-Sik [1 ]
Kim, Chung-Ryul [1 ]
Kim, Ki-Man [1 ]
Jung, Ji-Won [1 ]
机构
[1] Korea Maritime Univ, Dept Radio Sci & Engn, Pusan 606791, South Korea
基金
新加坡国家研究基金会;
关键词
broadband; Chebyshev function; impedance transformer; low-impedance matching; monolithic microwave integrated circuit (MMIC); periodically perforated ground metal (PPGM);
D O I
10.1109/TMTT.2006.881626
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, highly miniaturized on-chip impedance transformers employing periodically perforated ground metal (PPGM) were developed for application to broadband low-impedance matching. In order to realize a broadband operation by using an equal ripple transfer characteristic over a passband, a three-section transformer was designed by mapping its reflection coefficient to the Chebyshev function. The three-section transformer showed a good RF performance over a broadband (1.5-13 GHz) including ultra-wideband. The size of the three-section transformer was 0.129 mm(2), which is 2.3% of the size of the transformer fabricated by a conventional microstrip line. Using the PPGM structure, a highly miniaturized on-chip Wilkinson power divider with a low port impedance of 13 Omega was also developed, and its size is 0.11 mm(2), which is 6% of the size of the one fabricated by the conventional microstrip line. In addition, in this study, the PPGM structure was theoretically characterized using a conventional capacitive loaded periodic structure. Using the theoretical analysis, basic characteristics of the transmission line with PPGM were also investigated in order to evaluate its suitability for application to a development of miniaturized on-chip passive components. According to the, results, it was found that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip components on monolithic microwave integrated circuits.
引用
收藏
页码:3805 / 3817
页数:13
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