Fatigue crack nucleation assisted by thermal activation

被引：15

作者：

Fine, ME ^{[1
]}

Stolkarts, V ^{[1
]}

Keer, LM ^{[1
]}

机构：

[1] Northwestern Univ, Evanston, IL 60208 USA

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1999年 / 272卷 / 01期

关键词：

fatigue; crack; nucleation; activation; thermal; solder;

D O I：

10.1016/S0921-5093(99)00456-6

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Experimental evidence is presented that very early in the fatigue lifetime of Sn-Pb eutectic solder the fatigue damage is governed by microcrack nucleation. A model for thermally assisted fatigue crack initiation is presented using standard equations for nucleation in phase transformations. Predictions of the model are in good agreement with nucleation data for this solder. (C) 1999 Elsevier Science S.A. All rights reserved.

引用

页码：5 / 9

页数：5

共 13 条

[1]

BARENBLATT GI, 1982, DEFECTS FRACTURE, P71

[2] ELASTIC-MODULI OF A CRACKED SOLID [J].

BUDIANSKY, B ;

OCONNELL, RJ .

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 1976, 12 (02) :81-97

[3]

CUTIONGCO E, 1991, THESIS NW U

[4]

HERMAN H, 1960, T AM I MIN MET ENG, V218, P44

[5]

HERMAN H, 1962, T METALL SOC AIME, V224, P503

[6]

HERMAN H, 1961, THESIS NW U

[7]

HERMAN H, 1963, T METALL SOC AIME, V11, P43

[8]

James P.F., 1982, Advances in Ceramics) American Ceramic Society, V4, P1

[9] FATIGUE DAMAGE IN COPPER SINGLE-CRYSTALS AT ROOM AND CRYOGENIC TEMPERATURES [J].

KWON, IB ;

FINE, ME ;

WEERTMAN, J .

ACTA METALLURGICA, 1989, 37 (11) :2937-2946

[10] MICROSTRUCTURAL STUDIES ON THE INITIATION AND GROWTH OF SMALL FATIGUE CRACKS AT 298, 77-K AND 4.2-K IN POLYCRYSTALLINE COPPER [J].

KWON, IB ;

FINE, ME ;

WEERTMAN, J .

ACTA METALLURGICA, 1989, 37 (11) :2927-2936

← 1 2 →