Influence of bending strain on Bi-2223 tape

被引:5
作者
Nishimura, S
Kiss, T
Inoue, M
Ishimaru, M
Kiuchi, M
Takeo, M
Okamoto, H
Matsushita, T
Ito, K
机构
[1] Kyushu Univ, Grad Sch Informat Sci & Elect Engn, Dept Elect & Elect Syst Engn, Higashi Ku, Fukuoka 8128581, Japan
[2] Kyushu Elect Power Co, Fukuoka 8158520, Japan
[3] Kyushu Inst Technol, Dept Comp Sci & Elect, Iizuka, Fukuoka 8208502, Japan
[4] Natl Res Inst Mat Prague, Tsukuba, Ibaraki 3050047, Japan
来源
PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS | 2002年 / 372卷 / PART 2期
关键词
Bi-2223; tape; E-J characteristics; flux pinning; bending strain; percolation model;
D O I
10.1016/S0921-4534(02)00956-5
中图分类号
O59 [应用物理学];
学科分类号
摘要
The behavior of current-voltage (I-V) characteristics in Bi-2223 AgAgMg sheathed tape at various bending strain has been studied. The measured results were analyzed using the percolation model, and then the variation of critical current density, J(c), has been analyzed. As increasing of bending strain, J(c) in the tape is reduced irreversible way. The irreversible degradation indicates that the J(c) reduction is caused mainly by crack formation. However, if we extract statistic J(c) distribution taking into account the cracking, it can be seen that the value of local J(c) is enlarged in the remained region as the strain is increased. Namely, the pinning strength in the remained region is enlarged as the bending strain is increased. Present analysis allows us to separate the influence on grain connectivity and pinning strength originated from the strain. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:1001 / 1004
页数:4
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