On coupling contact analysis of thermoelectric materials

被引:25
作者
Zhou, Y. T. [1 ]
Tian, X. J. [1 ]
Li, F. J. [2 ]
机构
[1] Tongji Univ, Sch Aerosp Engn & Appl Mech, Shanghai 200092, Peoples R China
[2] Ningxia Univ, Sch Math & Stat, Yinchuan 750021, Ningxia, Peoples R China
基金
中国国家自然科学基金;
关键词
Seebeck effect; Punch; Closed-form solution; Surface contact stress; Intensity factors; BEHAVIOR; HEAT; TRANSIENT;
D O I
10.1016/j.apm.2020.08.024
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thermoelectric materials can harvest heat and turn it into electricity and vice versa, which could lead to more cost-effective devices and appliances. This article investigates the problem of electrical and thermal rigid punch acting on thermoelectric materials. Some full field quantities are given in a closed form. Importantly, some useful formulas for measuring the thermoelectric parameters by the indentation test are given. The nonlinear temperature due to thermoelectric effects can be expressed in convolutional form. For the elastic field, the surface contact stress and the stress intensity factors can be numerically evaluated. Meanwhile the convergence analysis of numerical calculation is conducted. The effects of the thermoelectric loads on the surface contact stress are detailed. The current research is not only beneficial to measuring the thermoelectric coupling properties of thermoelectric materials through punch experiments but also contributes to a deeper understanding of the contact behavior. (C) 2020 Elsevier Inc. All rights reserved.
引用
收藏
页码:1459 / 1474
页数:16
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