A Simple Miniature Ultrawideband Magnetic Field Probe Design for Magnetic Near-Field Measurements

被引:98
作者
Yan, Zhaowen [1 ]
Wang, Jianwei [1 ]
Zhang, Wei [1 ]
Wang, Yansheng [2 ]
Fan, Jun [2 ]
机构
[1] Beihang Univ, Sch Elect & Informat Engn, Beijing 100191, Peoples R China
[2] Missouri Univ Sci & Technol, EMC Lab, Rolla, MO 65409 USA
基金
中国国家自然科学基金;
关键词
Coax-thru-hole via array; near-field measurements; ultrawideband magnetic-field probe; via fence; COAX; VIAS;
D O I
10.1109/TAP.2016.2606556
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A simple miniature magnetic-field probe for near-field measurements in 9-kHz-20-GHz bandwidth, which is applied to high-speed circuits, has been proposed and manufactured. The magneticfield probe is built on a four-layer printed circuit board (PCB) using high-performance and low-loss Rogers material (epsilon(r) = 3.48 and tan delta = 0.0037). Electric field coupling can be suppressed by PCB shielding structure of the magnetic-field probe. Coax-thru-hole via array technique is used to achieve impedance match. The resonance in working frequency band is suppressed through via fence, making vertical bar S-21 vertical bar rather smooth in the operation band. Experimental results show that the working frequency band is up to 9 kHz-20 GHz.
引用
收藏
页码:5459 / 5465
页数:8
相关论文
共 14 条
[11]   Coax via - A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling [J].
Pillai, ER .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1997, 45 (10) :1981-1985
[12]   The Electromagnetic Compatibility of Integrated Circuits-Past, Present, and Future [J].
Ramdani, Mohamed ;
Sicard, Etienne ;
Boyer, Alexandre ;
Ben Dhia, Sonia ;
Whalen, James J. ;
Hubing, Todd H. ;
Coenen, Mart ;
Wada, Osami .
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2009, 51 (01) :78-100
[13]   A miniature thin-film shielded-loop probe with a flip-chip bonding for magnetic near field measurements [J].
Tamaki, N ;
Masuda, N ;
Kuriyama, T ;
Bu, JC ;
Yamaguchi, M ;
Arai, KI .
ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS, 2005, 88 (04) :37-45
[14]  
YU M, 1993, IEEE MTT-S, P705, DOI 10.1109/MWSYM.1993.277005