Frequency Response of Stress-Effects on CMOS Power Amplifiers

被引:0
作者
Cattaneo, A. [1 ,2 ]
Pinarello, S. [1 ,2 ]
Mueller, J. -E. [1 ]
Weigel, R. [2 ]
机构
[1] Intel Mobile Commun, Campeon 10-12, D-85579 Neubiberg, Germany
[2] Univ Erlangen Nurnberg, Inst Elect Engn, D-91058 Erlangen, Germany
来源
2014 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP FINAL REPORT (IIRW) | 2014年
关键词
Hot-Carrier; Reliability; Power Amplifiers; Interface States; DC;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
RF Power Amplifiers (PAs) undergo to high electrical stress conditions due to strong lateral field along the channel. Reliability of CMOS PAs is largely studied in literature. Generally is focused in understanding how RF stress can harm the device. Many authors proved that the generation of defects does not have a frequency dependency. In this work the problem is faced from a new point of view. The response of the defects, instead of the generation, is studied over frequency. It is demonstrated that the electrons-trapping by interface states is quenched by increasing the operation frequency. As a consequence the performance of the PA are recovered. This finding points out for the first time the possibility of relaxing the reliability constrains when operating in RF regime.
引用
收藏
页码:79 / 81
页数:3
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