Forced convection heat transfer from a low-profile block simulating a package of electronic equipment

Forced convection heat transfer from a low-profile block placed in a rectangular duct, simulating heat transfer in a compact packaged electronic device, is investigated experimentally. Local heat transfer from the block is measured by an infrared camera. A general correlation of the Nusselt number for the block is derived using a modified Reynolds number, Re*L = (Um/β2)L/v, where Um is mean duct velocity, β is the opening ratio of the duct, and L is the block length. The correlation is shown to be applicable regardless of the configuration of the block and duct, under the conditions of laminar flow, a low-profile block (height/length<0.5), and a low blockage effect (β≥0.5). © 2004 by ASME.