Micromachined semi-encapsulated spiral inductors for microelectromechanical systems (MEMS) applications

被引：13

作者：

Sadler, DJ ^{[1
]}

Zhang, WJ ^{[1
]}

Ahn, CH ^{[1
]}

Kim, HJ ^{[1
]}

Han, SH ^{[1
]}

机构：

[1] KOREAN INST TECHNOL & SCI,MAGNET ALLOY LAB,SEOUL,SOUTH KOREA

来源：

IEEE TRANSACTIONS ON MAGNETICS | 1997年 / 33卷 / 05期

关键词：

D O I：

10.1109/20.617930

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Semi-encapsulated spiral inductors for microelectromechanical systems (MEMS) applications have been designed, fabricated, and characterized using micromachining and electroplating techniques. The inductors are fabricated on a Pyrex glass wafer using a simple three mask process and have an area of 4 mm by 4 mm. Devices consist of electroplated copper conductor lines with width 50 mu m, thickness 25 mu m, and spacing 30 mu m; they are semi-encapsulated with an electroplated Ni-Fe (81%/19%) magnetic core. At the low frequency of 10kHz, the inductance of the devices was measured as 1.5 mu H, while they exhibited a low resistance of only 3 ohms. Their low resistance and reasonably high inductance makes them ideal in MEMS applications as either sensors or actuators.

引用

页码：3319 / 3321

页数：3

共 9 条

[1]

CHONG H, 1993, J MICROMECH MICROENG, V3, P37

[2]

CHONG H, IEEE ASME J MICROELE, V2, P15

[3] DESIGN OF PLANAR RECTANGULAR MICROELECTRONIC INDUCTORS [J].

GREENHOUSE, HM .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02) :101-109

[4]

HENSTOCK ME, 1963, 6 INT MET FIN C C P, P179

[5]

OLIVEI A, IEEE T PART MAT PACK, V5, P71

[6]

OSHIRO O, IEEE T MAGN, V23, P3759

[7]

ROSHEN WA, IEEE T MAGN, V26, P270

[8] MAGNETIC THIN-FILM INDUCTORS FOR INTEGRATED-CIRCUIT APPLICATIONS [J].

SOOHOO, RF .

IEEE TRANSACTIONS ON MAGNETICS, 1979, 15 (06) :1803-1805

[9]

ZHANG W, 1996, SOL STAT SENS ACT WO, P94

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