Microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment

被引：20

作者：

Hsuan, Teng-Chun ^{[1
]}

Lin, Kwang-Lung ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Frontier Mat & Micronano Sci & Technol Ctr, Tainan 70101, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2009年 / 469卷 / 1-2期

关键词：

Lead-free solder; Microstructure; Intermetallic; Precipitation; Phase transition; SN-ZN; MECHANICAL-PROPERTIES; GA CONTENT; LEAD-FREE; DIFFUSION; BEHAVIOR; INTERMETALLICS; ALLOYS;

D O I：

10.1016/j.jallcom.2008.01.121

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

This study investigated the microstructural evolution of epsilon-AgZn3 and eta-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder (5-e alloy) during isothermal aging treatment at 150 degrees C. Zn element easily precipitates on the surface of AgZn3 intermetallic compounds (IMCs) and grows rapidly during aging. During aging, Ag dissolves in the precipitated Zn which forms the Zn-rich phase (eta-Zn), the combination of epsilon-AgZn3 with precipitated Zn-rich became a diffusion couple. The epsilon-AgZn3 compound shrinks apparently upon heat exposure. Furthermore, at the interface of this diffusion couple, it seems to exit a phase transition between epsilon-AgZn3 IMC and eta-Zn phase. This phase transition mechanism will be discussed in this paper. (C) 2008 Elsevier B.V. All rights reserved.

引用

页码：350 / 356

页数：7

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