Microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment

被引：20

作者：

Hsuan, Teng-Chun ^{[1
]}

Lin, Kwang-Lung ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Frontier Mat & Micronano Sci & Technol Ctr, Tainan 70101, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2009年 / 469卷 / 1-2期

关键词：

Lead-free solder; Microstructure; Intermetallic; Precipitation; Phase transition; SN-ZN; MECHANICAL-PROPERTIES; GA CONTENT; LEAD-FREE; DIFFUSION; BEHAVIOR; INTERMETALLICS; ALLOYS;

D O I：

10.1016/j.jallcom.2008.01.121

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

This study investigated the microstructural evolution of epsilon-AgZn3 and eta-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder (5-e alloy) during isothermal aging treatment at 150 degrees C. Zn element easily precipitates on the surface of AgZn3 intermetallic compounds (IMCs) and grows rapidly during aging. During aging, Ag dissolves in the precipitated Zn which forms the Zn-rich phase (eta-Zn), the combination of epsilon-AgZn3 with precipitated Zn-rich became a diffusion couple. The epsilon-AgZn3 compound shrinks apparently upon heat exposure. Furthermore, at the interface of this diffusion couple, it seems to exit a phase transition between epsilon-AgZn3 IMC and eta-Zn phase. This phase transition mechanism will be discussed in this paper. (C) 2008 Elsevier B.V. All rights reserved.

引用

页码：350 / 356

页数：7

共 28 条

[1]

ANDERSON E, 1939, METALS HDB, P1750

[2] The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad [J].

Chang, SC ;

Lin, SC ;

Hsieh, KC .

JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (03) :399-405

[3] Effect of thermal cycling on the adhesion strength of Sn-9Zn-xAg-Cu interface [J].

Chang, TC ;

Hon, MH ;

Wang, MC ;

Lin, DY .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (01) :158-164

[4] The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - The effect of Ga [J].

Chen, KI ;

Lin, KL .

JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (10) :1111-1116

[5] Microstructure and mechanical properties of Sn-8.55Zn-1Ag-XAl solder alloys [J].

Cheng, SC ;

Lin, KL .

MATERIALS TRANSACTIONS, 2005, 46 (01) :42-47

[6] The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu [J].

Cheng, SC ;

Lin, KL .

JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (09) :940-945

[7] DIFFUSION OF GOLD AND SILVER IN TIN SINGLE CRYSTALS [J].

DYSON, BF .

JOURNAL OF APPLIED PHYSICS, 1966, 37 (06) :2375-&

[8] Thermodynamic assessment of the Ag-Zn system [J].

Gomez-Acebo, T .

CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, 1998, 22 (02) :203-220

[9] Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder [J].

Hsuan, Teng-Chun ;

Lin, Kwang-Lung .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 456 (1-2) :202-209

[10] Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders [J].

Huang, CW ;

Lin, KL .

JOURNAL OF MATERIALS RESEARCH, 2003, 18 (07) :1528-1534

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