Effect of Interfacial Properties of p-GaN/Sputter-Deposited NiAg-Based Electrode on Optical Properties of Vertical GaN-Based LEDs

被引:5
作者
Kim, Sunjung [1 ]
机构
[1] Univ Ulsan, Sch Mat Sci & Engn, Ulsan 680749, South Korea
关键词
THIN-FILMS; AG;
D O I
10.1149/1.3238468
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The influence of the interfacial adhesion and reflectance of a p-GaN/NiAgNiAu p-electrode on the optical properties of vertical GaN-based light emitting diodes (LEDs) was investigated. The thickness of the sputter-deposited Ni ohmic contact was varied from 2 to 100 nm. The p-electrode with a 2 nm thick Ni layer showed the highest adhesion strength of 160 MPa to the p-GaN and the highest reflectance of 80.79% after annealing because all the Ni atoms participated in the indiffusion into p-GaN and formed a transparent NiO. The NiAgNiAu p-electrodes with a higher reflectance led to the improved output power of the vertical LEDs regardless of the interfacial adhesion strength of p-GaN/Ni. (C) 2009 The Electrochemical Society. [DOI:10.1149/1.3238468] All rights reserved.
引用
收藏
页码:H441 / H444
页数:4
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