Vacuum packaged electromagnetic 2D scanning micromirror

被引：11

作者：

Chung, Seung-Han ^{[1
]}

Lee, Seung-Ki ^{[1
]}

Ji, Chang-Hyeon ^{[2
]}

Park, Jae-Hyoung ^{[1
]}

机构：

[1] Dankook Univ, Dept Elect & Elect Engn, Yongin 16890, South Korea

[2] Ewha Womans Univ, Dept Elect & Elect Engn, 52 Ewhayeodae Gil, Seoul 03760, South Korea

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2019年 / 290卷

基金：

新加坡国家研究基金会;

关键词：

Electromagnetic biaxial scanning micromirror; Vacuum packaging; Wafer-level packaging; OPTICAL SCANNER; MEMS; MICROSCANNER; FABRICATION; TECHNOLOGY;

D O I：

10.1016/j.sna.2019.03.021

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We herein present the design, fabrication, and wafer-level packaging of an electromagnetic biaxial scanning micromirror. The vacuum packaging of the micromirror was implemented by anodically bonding the glass cap wafer to both sides of the silicon substrate with the micromirror. The measured quality factor of the vacuum packaged micromirror is 1923.2 for the horizontal scan, whereas that of the device in the air is 649.6. The maximum optical scan angle of the vacuum packaged micromirror is 24.19 degrees at 155 mApp and 11.9 kHz for the horizontal scan, and 7.1 degrees at 204.7 mApp and 60 Hz for the vertical scan. The estimated vacuum level of the package is 1.65 +/- 0.85 Torr. (C) 2019 Elsevier B.V. All rights reserved.

引用

页码：147 / 155

页数：9

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