Controllable P- and N-Type Conversion of MoTe2 via Oxide Interfacial Layer for Logic Circuits

被引:56
|
作者
Park, Yong Ju [1 ]
Katiyar, Ajit K. [1 ]
Anh Tuan Hoang [1 ]
Ahn, Jong-Hyun [1 ]
机构
[1] Yonsei Univ, Sch Elect & Elect Engn, Seoul 03722, South Korea
基金
新加坡国家研究基金会;
关键词
electron doping; logic gate; MoTe2; transistors; type conversion; FIELD-EFFECT TRANSISTORS; MOS2; TRANSISTOR; DEPOSITION; CONTACTS; MOBILITY; ENHANCEMENT; REDUCTION;
D O I
10.1002/smll.201901772
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
To realize basic electronic units such as complementary metal-oxide-semiconductor (CMOS) inverters and other logic circuits, the selective and controllable fabrication of p- and n-type transistors with a low Schottky barrier height is highly desirable. Herein, an efficient and nondestructive technique of electron-charge transfer doping by depositing a thin Al2O3 layer on chemical vapor deposition (CVD)-grown 2H-MoTe2 is utilized to tune the doping from p- to n-type. Moreover, a type-controllable MoTe2 transistor with a low Schottky barrier height is prepared. The selectively converted n-type MoTe2 transistor from the p-channel exhibits a maximum on-state current of 10 mu A, with a higher electron mobility of 8.9 cm(2) V-1 s(-1) at a drain voltage (V-ds) of 1 V with a low Schottky barrier height of 28.4 meV. To validate the aforementioned approach, a prototype homogeneous CMOS inverter is fabricated on a CVD-grown 2H-MoTe2 single crystal. The proposed inverter exhibits a high DC voltage gain of 9.2 with good dynamic behavior up to a modulation frequency of 1 kHz. The proposed approach may have potential for realizing future 2D transition metal dichalcogenide-based efficient and ultrafast electronic units with high-density circuit components under a low-dimensional regime.
引用
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页数:9
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