Investigation of the Reliability Behavior of Conductive-Bridging Memory Cells

被引:34
作者
Symanczyk, Ralf [1 ]
Bruchhaus, Rainer [1 ]
Dittrich, Rok [2 ]
Kund, Michael [1 ]
机构
[1] Qimonda AG, D-81707 Munich, Germany
[2] Qimonda Dresden GmbH & Co OHG, D-01099 Dresden, Germany
关键词
CBRAM; chalcogenide; nonvolatile memory; reliability; retention;
D O I
10.1109/LED.2009.2024623
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Conductive-bridging memory can store information as different resistance states even when not powered. In order to check reliability challenges for nonvolatile-memory applications, the data retention has to be tested carefully. This letter describes a new test scheme using electrical bias for acceleration and enables the fast recording of such detailed information. Experimental data for memory devices based on Ag:GeS2 as the active-matrix material are presented. Excellent stability and reproducibility of the resistance states for more than 300 cycles are demonstrated in the temperature range from 25 degrees C to 85 degrees C. Based on the calculated activation energy, ten years of data retention is extrapolated.
引用
收藏
页码:876 / 878
页数:3
相关论文
共 9 条
[1]  
[Anonymous], P NONV MEM TECHN S
[2]  
Honigschmid H., 2006, P VLSI CIRC, P138
[3]   A nonvolatile programmable solid-electrolyte nanometer switch [J].
Kaeriyama, S ;
Sakamoto, T ;
Sunamura, H ;
Mizuno, M ;
Kawaura, H ;
Hasegawa, T ;
Terabe, K ;
Nakayama, T ;
Aono, M .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2005, 40 (01) :168-176
[4]  
KAMALANATHAN D, 2007, P NONV MEM TECHN S, P91
[5]   Information storage using nanoscale electrodeposition of metal in solid electrolytes [J].
Kozicki, MN ;
Mitkova, M ;
Park, M ;
Balakrishnan, M ;
Gopalan, C .
SUPERLATTICES AND MICROSTRUCTURES, 2003, 34 (3-6) :459-465
[6]  
Kund M, 2005, INT EL DEVICES MEET, P773
[7]  
Schindler C, 2007, P NVMTS, P82
[8]  
Symanczyk R., 2003, P NVMTS TECH DIG, P1
[9]   Resistive switching mechanism in ZnxCd1-xS nonvolatile memory devices [J].
Wang, Zheng ;
Griffin, Peter B. ;
McVittie, Jim ;
Wong, Simon ;
McIntyre, Paul C. ;
Nishi, Yoshio .
IEEE ELECTRON DEVICE LETTERS, 2007, 28 (01) :14-16