Measurement and Comparative Analysis of Shielding Effectiveness of Different Sputtered Materials

被引:0
作者
Song, Kyunghwan [1 ]
Cho, Yeonje [1 ]
Kim, Subin [1 ]
Jeong, Seungtaek [1 ]
Kim, Dong-Hyun [1 ]
Kim, Hongseok [1 ]
Kim, Joungho [1 ]
Kim, Bongsuk [2 ]
Heo, Jin [2 ]
Jung, Yusup [2 ]
机构
[1] Korea Adv Inst Sci & Technol, TeraByte Interconnect & Package Lab, Daejeon, South Korea
[2] Core & Integrat Technol Inc, R&D Ctr, Hwaseong, South Korea
来源
2017 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & SIGNAL/POWER INTEGRITY (EMCSI) | 2017年
关键词
Sputtering; metal; ferromagnetic material; electromagnetic interference; shielding effectiveness;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Recently, high density integrated circuits are packaged in the electronic devices such as smartphones and smartwatches. Power amplifier modules integrated in such devices interact with other circuits due to its inductive components, and may cause the electromagnetic interference issues. To reduce the electromagnetic issues, sputtering technology can be used. In this paper, we present the shielding effectiveness measurement results of sputtered shielding materials in the low-frequency range from 30 kHz to 20 MHz using a vector network analyzer. Sputtered shielding materials are copper, nickel, titanium and stainless steel. By comparing the insertion loss, the shielding effectiveness is analyzed. The effect of the sputtered materials' thickness is also analyzed. Among the four materials, sputtered copper has the highest shielding effectiveness.
引用
收藏
页码:355 / 359
页数:5
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