The location and effects of Si in (Ti1-xSix)Ny thin films

被引:54
作者
Flink, Axel [1 ]
Beckers, Manfred [1 ]
Sjolen, Jacob [2 ]
Larsson, Tommy [2 ]
Braun, Slawomir [3 ]
Karlsson, Lennart [2 ]
Hultman, Lars [1 ]
机构
[1] Linkoping Univ, Dept Phys Chem & Biol IFM, Thin Film Phys Div, SE-58183 Linkoping, Sweden
[2] Seco Tools AB, SE-73782 Fagersta, Sweden
[3] Linkoping Univ, Dept Phys Chem & Biol IFM, Div Surface Phys & Chem, SE-58183 Linkoping, Sweden
基金
瑞典研究理事会;
关键词
SOLID-SOLUTIONS; MICROSTRUCTURE; GROWTH; MORPHOLOGY; MECHANISM; THICKNESS; HARDNESS; DESIGN; ENERGY; LAYERS;
D O I
10.1557/JMR.2009.0299
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
(Ti1-xSix)N-y (0 <= x <= 0.20; 0.99 <= y(x) <= 1.13) thin films deposited by arc evaporation have been investigated by analytical transmission electron microscopy, x-ray diffraction, x-ray photoelectron spectroscopy, and nanoindentation. Films with x <= 0.09 are single-phase cubic (Ti,Si)N solid solutions with a dense columnar microstructure. Films with x > 0.09 haven a featherlike microstructure consisting of cubic TiN:Si nanocrystallite bundles separated by metastable SiNz with coherent-to-semicoherent interfaces and a dislocation density of as much as 10(14) cm(-2) is present. The films exhibit retained composition and hardness between 31 and 42 GPa in annealing experiments to 1000 degrees C due to segregation of SiN, to the grain boundaries. During annealing at 1100-1200 degrees C, this tissue phase thickens and transforms to amorphous SiNz. At the same time, Si and N diffuse out of the films via the grain boundaries and TiN recrystallize.
引用
收藏
页码:2483 / 2498
页数:16
相关论文
共 41 条
  • [1] ALLING B, 2008, UNPUB
  • [2] Boxman R.L., 1995, Handbook of Vacuum Arc Science, Fundamentals and Applications
  • [3] ESCA AND SEXAFS INVESTIGATIONS OF INSULATING MATERIALS FOR ULSI MICROELECTRONICS
    FINSTER, J
    KLINKENBERG, ED
    HEEG, J
    BRAUN, W
    [J]. VACUUM, 1990, 41 (7-9) : 1586 - 1589
  • [4] SUBSTITUTIONAL SOLUTION HARDENING
    FLEISCHER, RL
    [J]. ACTA METALLURGICA, 1963, 11 (03): : 203 - &
  • [5] Influence of Si on the microstructure of arc evaporated (Ti,Si)N thin films;: evidence for cubic solid solutions and their thermal stability
    Flink, A
    Larsson, T
    Sjölén, J
    Karlsson, L
    Hultman, L
    [J]. SURFACE & COATINGS TECHNOLOGY, 2005, 200 (5-6) : 1535 - 1542
  • [6] Experimental and theoretical study of the electronic properties Of COSi2 and NiSi2
    García-Méndez, M
    Galvan, DH
    Posada-Amarillas, A
    Farías, MH
    [J]. APPLIED SURFACE SCIENCE, 2004, 230 (1-4) : 386 - 392
  • [7] ESCA STUDY OF AMORPHOUS CVD SI3N4-BN COMPOSITES
    GOTO, T
    HIRAI, T
    [J]. JOURNAL OF MATERIALS SCIENCE LETTERS, 1988, 7 (05) : 548 - 550
  • [8] THE DEFORMATION AND AGEING OF MILD STEEL .3. DISCUSSION OF RESULTS
    HALL, EO
    [J]. PROCEEDINGS OF THE PHYSICAL SOCIETY OF LONDON SECTION B, 1951, 64 (381): : 747 - 753
  • [9] Microstructure and properties of Ti-Si-N films prepared by plasma-enhanced chemical vapor deposition
    He, JL
    Chen, CK
    Hon, MH
    [J]. MATERIALS CHEMISTRY AND PHYSICS, 1996, 44 (01) : 9 - 16
  • [10] Study on the superhardness mechanism of Ti-Si-N nandcomposite films:: Influence of the thickness of the Si3N4 interfacial phase
    Hu, XP
    Zhang, HJ
    Dai, JW
    Li, GY
    Gu, MY
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2005, 23 (01): : 114 - 117