Ultrafine Pitch Stencil Printing of Liquid Metal Alloys

被引:68
作者
Lazarus, Nathan [1 ]
Bedair, Sarah S. [1 ]
Kierzewski, Iain M. [2 ]
机构
[1] US Army Res Lab, 2800 Powder Mill Rd, Adelphi, MD 20783 USA
[2] Gen Tech Serv Inc, Army Res Lab, 2800 Powder Mill Rd, Adelphi, MD 20783 USA
关键词
liquid metal; stencil printing; stretchable electronics; electroplated stencil; galinstan; STRETCHABLE ELECTRONICS; SOLDER PASTE; FINE; TEMPERATURE; DENSITY; CORE;
D O I
10.1021/acsami.6b13088
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
With high conductivity and stretchable for large cross-sections, liquid metals such as galinstan are promising for creating stretchable devices and interconnects. Creating high resolution features in parallel is challenging, with most techniques limited to a hundred micrometers or more. In this work, multilevel electroplated stencils are investigated for printing liquid metals, with galinstan features as small as ten micrometers printed on soft elastomers, a factor of 10 reduction over past liquid metal stencil printing. Capacitors and resistive strain sensors are also demonstrated, showing the potential for creating stretchable conductors and devices.
引用
收藏
页码:1178 / 1182
页数:5
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