Half-DRAM: a High-bandwidth and Low-power DRAM Architecture from the Rethinking of Fine-grained Activation

被引:0
|
作者
Zhang, Tao [1 ,2 ]
Chen, Ke [3 ]
Xu, Cong [1 ]
Sun, Guangyu [4 ]
Wang, Tao [4 ]
Xie, Yuan [1 ]
机构
[1] Penn State Univ, University Pk, PA 16802 USA
[2] NVIDIA Corp, Santa Clara, CA USA
[3] Oracle Corp, Santa Clara, CA USA
[4] Peking Univ, Beijing, Peoples R China
基金
美国国家科学基金会; 中国国家自然科学基金;
关键词
MEMORY; ENERGY; REFRESH; DESIGN;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
DRAM memory is a major contributor for the total power consumption in modern computing systems. Consequently, power reduction for DRAM memory is critical to improve system-level power efficiency. Fine-grained DRAM architecture [1, 2] has been proposed to reduce the activation/precharge power However those prior work either incurs significant performance degradation or introduces large area overhead. In this paper; we propose a novel memory architecture Half-DRAM, in which the DRAM array is reorganized to enable only half of a row being activated. The half-row activation can effectively reduce activation power and meanwhile sustain the full bandwidth one bank can provide. In addition, the half: row activation in Half-DRAM relaxes the power constraint in DRAM, and opens up opportunities for further performance gain. Furthermore, two half: row accesses can be issued in parallel by integrating the sub-array level parallelism to improve the memory level parallelism. The experimental results show that Half-DRAM can achieve both significant performance improvement and power reduction, with negligible design overhead.
引用
收藏
页码:349 / 360
页数:12
相关论文
共 50 条
  • [41] Capacitor-less, Long-Retention (>400s) DRAM Cell Paving the Way towards Low-Power and High-Density Monolithic 3D DRAM
    Belmonte, A.
    Oh, H.
    Rassoul, N.
    Donadio, G. L.
    Mitard, J.
    Dekkers, H.
    Delhougne, R.
    Subhechha, S.
    Chasin, A.
    van Setten, M. J.
    Kljucar, L.
    Mao, M.
    Puliyalil, H.
    Pak, M.
    Teugels, L.
    Tsvetanova, D.
    Banerjee, K.
    Souriau, L.
    Tokei, Z.
    Goux, L.
    Kar, G. S.
    2020 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2020,
  • [42] A New Surface Potential and Physics Based Compact Model for a-IGZO TFTs at Multinanoscale for High Retention and Low-Power DRAM Application
    Guo, Jingrui
    Han, Kaizhen
    Subhechha, Subhali
    Duan, Xinlv
    Chen, Qian
    Geng, Di
    Huang, Shijie
    Xu, Lihua
    An, Junjie
    Kar, Gouri Sankar
    Gong, Xiao
    Wang, Lingfei
    Li, Ling
    Liu, Ming
    2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
  • [43] A Computer Designed Half Gb 16-Channel 819Gb/s High-Bandwidth and 10ns Low-Latency DRAM for 3D Stacked Memory Devices Using TSVs
    Luo, Pei-Wen
    Chen, Chi-Kang
    Sung, Yu-Hui
    Wu, Wei
    Shih, Hsiu-Chuan
    Lee, Chia-Hsin
    Lee, Kuo-Hua
    Lie, Ming-Wei
    Lung, Mei-Chiang
    Lu, Chun-Nan
    Chou, Yung-Fa
    Shih, Po-Lin
    Kee, Chung-Hu
    Shiah, Chun
    Stolt, Patrick
    Tomishima, Shigeki
    Kwai, Ding-Ming
    Rong, Bor-Doou
    Lu, Nicky
    Lu, Shih-Lien
    Wu, Cheng-Wen
    2015 SYMPOSIUM ON VLSI CIRCUITS (VLSI CIRCUITS), 2015,
  • [44] Low-Power High-Bandwidth Non-Polar InGaN Micro-LEDs at Low Current Densities for Energy-Efficient Visible Light Communication
    Zhu, Shijie
    Shan, Xinyi
    Qiu, Pengjiang
    Wang, Zhou
    Yuan, Zexing
    Cui, Xugao
    Zhang, Guoqi
    Tian, Pengfei
    IEEE PHOTONICS JOURNAL, 2022, 14 (05):
  • [45] A Digital-PLL-Based Quadrature Clock Generator for a Low-Power and Jitter-Filtering-Capable Clock Distribution Scheme in High-Speed DRAM Interfaces
    Shin, Yuhwan
    Jo, Yongwoo
    Kim, Juyeop
    Lee, Junseok
    Kim, Jongwha
    Choi, Jaehyouk
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2025, 60 (02) : 509 - 518
  • [46] Design of 1024-I/Os 3.84 GB/s high bandwidth 600 mW low power 16 Mb DRAM macros for parallel image processing RAM
    Aimoto, Y
    Kimura, T
    Yabe, Y
    Heiuchi, H
    Nakazawa, Y
    Motomura, M
    Koga, T
    Fujita, Y
    Hamada, M
    Tanigawa, T
    Nobusawa, H
    Koyama, K
    IEICE TRANSACTIONS ON ELECTRONICS, 1998, E81C (05) : 759 - 767
  • [47] Dual-Input Stacked Inverter-Based Single-Ended DRAM Sense Amplifier Using BL Switches for Low-Power High-Speed Sensing
    Lim, Sehee
    Jung, In Jun
    Kim, Gi Seok
    Ko, Dong Han
    Lee, Sumin
    Jung, Seong-Ook
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2024,
  • [48] A design of a capacitorless 1T-DRAM cell using gate-induced drain leakage (GIDL) current for low-power and high-speed embedded memory
    Yoshida, E
    Tanaka, T
    2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST, 2003, : 913 - 916
  • [49] A capacitorless 1T-DRAM technology using gate-induced drain-leakage (GIDL) current for low-power and high-speed embedded memory
    Yoshida, E
    Tanaka, T
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2006, 53 (04) : 692 - 697
  • [50] Optimal Design Methods to Transform 3D NAND Flash into a High-Density, High-Bandwidth and Low-Power Nonvolatile Computing in Memory (nvCIM) Accelerator for Deep-Learning Neural Networks (DNN)
    Lue, Hang-Ting
    Hsu, Po-Kai
    Wei, Ming-Liang
    Yeh, Teng-Hao
    Du, Pei-Ying
    Chen, Wei-Chen
    Wang, Keh-Chung
    Lu, Chih-Yuan
    2019 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2019,