Interfacial intermetallic growth and shear strength of lead-free composite solder joints

被引：131
作者：
Nai, S. M. L. [1 ]
Wei, J. [2 ]
Gupta, M. [1 ]
机构：
[1] Natl Univ Singapore, Dept Mech Engn, Singapore 117576, Singapore
[2] Singapore Inst Mfg Technol, Singapore 638075, Singapore
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2009年 / 473卷 / 1-2期
关键词：
Intermetallics; Metal matrix composites; Mechanical properties; Scanning electron microscopy; SN-AG SOLDER; MECHANICAL-PROPERTIES; FRACTURE-BEHAVIOR; CREEP-PROPERTIES; EUTECTIC SNPB; CU; SN-3.5AG; COMPOUND; MICROSTRUCTURE; METALLIZATION;
D O I：
10.1016/j.jallcom.2008.05.070
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
In the present study, varying weight percentages of carbon nanotubes (CNTs) were incorporated into Sn-Ag-Cu solder matrix, to form composite solders. Isothermal aging study was performed on solder joints, to investigate the formation and growth of the intermetallic compound (IMC) layer at the solder/metallization interface. Shear tests were also conducted on as-soldered and aged solder joints. Results revealed that after soldering, the initial interfacial IMC thickness of the unreinforced solder joint was comparable to that of the composite solder joints. However, after aging, the interfacial IMC layer of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Moreover, the composite solder joints also exhibited lower diffusion coefficient and this signified that the presence of CNTs was effective in retarding the growth of the IMC layer. Shear tests results revealed that as-soldered and aged composite solder joints had better shear strength than their monolithic counterparts and the shear strength of all aged solder joints decreased with increasing aging time. (C) 2008 Elsevier B.V. All rights reserved.
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页码：100 / 106
页数：7
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