Singular elastic field induced by a rigid line adhering to a micro/nanoscale plate during bending

被引:4
|
作者
Hu, Zhen-Liang [1 ]
Yang, Ying [1 ]
Li, Xian-Fang [1 ]
机构
[1] Cent South Univ, Sch Civil Engn, Changsha 410075, Peoples R China
基金
中国国家自然科学基金;
关键词
Rigid line; Surface elasticity; Parabolic displacement; Exact elastic fields; Singularity coefficients; SURFACE STRESS; STRENGTH; SUBSTRATE; KIRCHHOFF;
D O I
10.1016/j.apm.2022.04.004
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work, the elastic analysis of a micro/nanoscale plate with a stiffer ribbon adhering to it is studied. The stiffer ribbon is understood as a rigid line. The problem is solved by superposition and the singular elastic field induced by a rigid line is concerned when the plate is during bending. The singular elastic field of a micro/nanoscale elastic thin plate with surface elasticity is determined for a parabolic rigid line. The theoretical analysis is based on a mixed boundary value problem that is solved through the Fourier integral transform technique. According to the classical Kirchhoff thin plate theory incorporating surface elasticity, some basic equations are established. The mixed boundary value problem is reduced to a singular integral equation of the first kind with Cauchy kernel. Explicit expressions for the moments and effective shear forces as well as the surface and bulk stress components in any position of the whole nanoplate are obtained. The singularity coefficients of the moment and effective shear force at the tip of the rigid line are determined in closed form. From the obtained results, we find that the normal stress components for bulk and surface phases and bending moments at the rigid line tips have a usual inverse square-root singularity, but the effective shear forces behave like r(-3/2), r being the distance from the tip of the rigid line or admit an r(-3/2) singularity. The numerical results are displayed graphically and show that the singularity coefficients are heavily dependent on the surface and bulk material constants. (C) 2022 Elsevier Inc. All rights reserved.
引用
收藏
页码:567 / 584
页数:18
相关论文
共 36 条
  • [21] Accurate elastic field in non-homogeneous geo-material halfspace under axisymmetric indentation of circular rigid plate
    Xiao, Sha
    Yue, Zhongqi Quentin
    MECHANICS RESEARCH COMMUNICATIONS, 2024, 139
  • [22] Micro-Bubble Phenomenon in Nanoscale Water-based Lubricating Film Induced by External Electric Field
    Guoxin Xie
    Jianbin Luo
    Shuhai Liu
    Chenhui Zhang
    Xinchun Lu
    Tribology Letters, 2008, 29 : 169 - 176
  • [23] Micro-bubble phenomenon in nanoscale water-based lubricating film induced by external electric field
    Xie, Guoxin
    Luo, Jianbin
    Liu, Shuhai
    Zhang, Chenhui
    Lu, Xinchun
    TRIBOLOGY LETTERS, 2008, 29 (03) : 169 - 176
  • [24] Three-dimensional singular stress field near the interfacial bond line of a tapered jointed plate either free-standing (notch) or (fully/partially) attached to a super-rigid inclusion (antinotch)
    Chaudhuri, Reaz A.
    Chiu, Sou-Hsiung Jack
    ENGINEERING FRACTURE MECHANICS, 2012, 91 : 87 - 102
  • [25] Relaxation of the elastic field of a crystal during the subgrain boundary formation induced by plastic deformation
    Sarafanov G.F.
    Perevezentsev V.N.
    Russian Metallurgy (Metally), 2017, 2017 (10) : 775 - 778
  • [26] Intensity of singular stress field over the entire bond line thickness range useful for evaluating the adhesive strength for plate and cylinder butt joints
    Noda, Nao-Aki
    Ren, Fei
    Takaki, Rei
    Wang, Zefeng
    Oda, Kazuhiro
    Miyazaki, Tatsujiro
    Sano, Yoshikazu
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2018, 85 : 234 - 250
  • [28] The stress concentration near a rigid line inclusion in a prestressed, elastic material. Part I. Full-field solution and asymptotics
    Dal Corso, Francesco
    Bigoni, Davide
    Gei, Massimillano
    JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2008, 56 (03) : 815 - 838
  • [29] Elastic stress field model and micro-crack evolution for isotropic brittle materials during single grit scratching
    Wang, Wei
    Yao, Peng
    Wang, Jun
    Huang, Chuanzhen
    Kuriyagawa, Tsunemoto
    Zhu, Hongtao
    Zou, Bin
    Liu, Hanlian
    CERAMICS INTERNATIONAL, 2017, 43 (14) : 10726 - 10736
  • [30] A Numerical Model using the Phase Field Method for Stress Induced Voiding in a Metal Line during Thermal Bake
    Oh, Yong-Seog
    Lee, Hyerim
    Avci, Ibrahim
    Park, Sora
    Jeon, Jongsung
    Kim, Jinseok
    Sari, Windu
    2013 18TH INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES (SISPAD 2013), 2013, : 13 - 16