Development of a 150 mm 4H-SiC epitaxial reactor with high-speed wafer rotation

被引:23
作者
Fujibayashi, Hiroaki [1 ,2 ]
Ito, Masahiko [1 ]
Ito, Hideki [1 ,3 ]
Kamata, Isaho [1 ]
Naito, Masami [2 ]
Hara, Kazukuni [2 ]
Yamauchi, Shoichi [2 ]
Suzuki, Kunihiko [3 ]
Yajima, Masayoshi [3 ]
Mitani, Shinichi [3 ]
Suzuki, Katsumi [4 ]
Aoki, Hirofumi [4 ]
Nishikawa, Koichi [5 ]
Kozawa, Takahiro [5 ]
Tsuchida, Hidekazu [1 ]
机构
[1] Cent Res Inst Elect Power Ind, Yokosuka, Kanagawa 2400196, Japan
[2] DENSO Corp, Kariya, Aichi 4488681, Japan
[3] NuFlare Technol Inc, Numazu, Shizuoka 4108510, Japan
[4] Toyota Motor Co Ltd, Toyota, Aichi 4718571, Japan
[5] Toyota Cent Res & Dev Labs Inc, Nagakute, Aichi 4801192, Japan
关键词
CHEMICAL-VAPOR-DEPOSITION; GROWTH; LAYERS; SIMULATION; EPILAYERS; FLOW;
D O I
10.7567/APEX.7.015502
中图分类号
O59 [应用物理学];
学科分类号
摘要
A new type of 150 mm vertical 4H-SiC epitaxial reactor with high-speed wafer rotation has been developed. Multiple resistance heaters ensure uniform radial temperature distribution throughout a 150-mm-diameter wafer. Enhancement of the growth rates is realized by high-speed wafer rotation under a relatively high system pressure, and growth rates of 40-50 mu m/h are achieved on 4 degrees off 4H-SiC substrates, maintaining a low defect density and a smooth surface without macrostep bunching. Excellent thickness and doping uniformities are simultaneously obtained for a 150-mm-diameter wafer at a high growth rate of 50 mu m/h. (C) 2014 The Japan Society of Applied Physics
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页数:4
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