Material Classification for Printed Circuit Boards by Spectral Imaging System

被引:0
|
作者
Ibrahim, Abdelhameed [1 ]
Tominaga, Shoji [1 ]
Horiuchi, Takahiko [1 ]
机构
[1] Chiba Univ, Grad Sch Adv Integrat Sci, Dept Informat Sci, Chiba, Japan
来源
COMPUTATIONAL COLOR IMAGING | 2009年 / 5646卷
关键词
Spectral imaging system; material classification; printed circuit board; spectral reflectance; region segmentation; k-means; normalized cut; INSPECTION; ALGORITHM; MODEL;
D O I
暂无
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
This paper presents an approach to a reliable material classification for printed circuit boards (PCBs) by constructing a spectral imaging system. The system works in the whole spectral range [400-700nm] and the high spectral resolution. An algorithm is presented for effectively classifying the surface material on each pixel point into several elements such as substrate, metal, resist, footprint, and paint, based on the surface-spectral reflectance estimated from the spectral imaging data. The proposed approach is an incorporation of spectral reflectance estimation, spectral feature extraction, and image segmentation processes for material classification of raw PCBs. The performance of the proposed method is compared with other methods using the RGB-reflectance based algorithm, the k-means algorithm and the normalized cut algorithm. The experimental results show the superiority of our method in accuracy and computational cost.
引用
收藏
页码:216 / 225
页数:10
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