Modeling Methodologies for Multi Level PCB-Package Co-Simulation & Co-Design

被引：0
|
作者：
Scogna, Antonio Ciccomancini [1 ]
Chiang, ChunTong [2 ]
Lau, Linus [3 ]
机构：
[1] CST Amer Inc, 492 Old Connecticut Path,505, Framingham, MA 01701 USA
[2] CST S E Asia, Singapore, Singapore
[3] CST, Kepong, Malaysia
来源：
2013 IEEE 22ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS) | 2013年
关键词：
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
引用
收藏
页码：57 / 57
页数：1
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