Modeling Methodologies for Multi Level PCB-Package Co-Simulation & Co-Design

被引：0
|
作者：
Scogna, Antonio Ciccomancini [1 ]
Chiang, ChunTong [2 ]
Lau, Linus [3 ]
机构：
[1] CST Amer Inc, 492 Old Connecticut Path,505, Framingham, MA 01701 USA
[2] CST S E Asia, Singapore, Singapore
[3] CST, Kepong, Malaysia
来源：
2013 IEEE 22ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS) | 2013年
关键词：
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
引用
收藏
页码：57 / 57
页数：1
相关论文
共 50 条
  • [1] Electrical/Thermal Co-Design and Co-Simulation, from Chip, Package, Board to System
    Kao, C. T.
    Kuo, An-Yu
    Dai, Yun
    2016 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2016,
  • [2] Electromagnetic and Thermal Co-Analysis for distributed co-design and co-simulation of chip, package and board
    Wane, Sidina
    Kuo, An-Yu
    2008 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM, VOLS 1 AND 2, 2008, : 423 - +
  • [3] Interaction of co-design and co-simulation, based on multi-block-systems
    Siemers, C
    Möller, DPF
    SIMULATION IN INDUSTRY'99: 11TH EUROPEAN SIMULATION SYMPOSIUM 1999, 1999, : 36 - 40
  • [4] Electromagnetic Partitioning Methodology Towards Multi-Physics Chip-Package-Board Co-Design and Co-Simulation
    Wane, Sidina
    Bajon, Damienne
    ELECTROMAGNETICS AND NETWORK THEORY AND THEIR MICROWAVE TECHNOLOGY APPLICATIONS: A TRIBUTE TO PETER RUSSER, 2011, : 227 - 254
  • [5] Networked control system co-simulation for co-design
    Branicky, MS
    Liberatore, V
    Phillips, SM
    PROCEEDINGS OF THE 2003 AMERICAN CONTROL CONFERENCE, VOLS 1-6, 2003, : 3341 - 3346
  • [6] Dynamic Power and Signal Integrity Analysis for Chip-Package-Board Co-Design and Co-Simulation
    Wane, Sidina
    Kuo, An-Yu
    Dos Santos, Patrick
    EUWIT: 2009 EUROPEAN WIRELESS TECHNOLOGY CONFERENCE, 2009, : 246 - +
  • [7] Dynamic Power and Signal Integrity Analysis for Chip-Package-Board Co-Design and Co-Simulation
    Wane, Sidina
    Kuo, An-Yu
    Dos Santos, Patrick
    2009 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC 2009), 2009, : 527 - +
  • [8] Chip-Package-PCB Co-Simulation for Power Integrity Design at the Early Design Stage
    Uematsu, Yutaka
    Taniguchi, Hitoshi
    Toyama, Masahiro
    Yagyu, Masayoshi
    Osaka, Hideki
    2015 IEEE 4TH ASIA-PACIFIC CONFERENCE ON ANTENNAS AND PROPAGATION (APCAP), 2015, : 451 - 452
  • [9] Co-simulation and Co-design of Chip-Package-Board Interfaces in Highly- Integrated RF Systems
    Issakov, V.
    Wojnowski, M.
    Knapp, H.
    Trotta, S.
    Forstner, H. -P.
    Pressel, K.
    Hagelauer, A.
    2016 IEEE BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING (BCTM), 2016, : 94 - 101
  • [10] Chip-Package Co-Design Methodology for Global Co-Simulation of Re-Distribution Layers (RDL)
    Wane, Sidina
    Kuo, An-Yu
    2008 IEEE-EPEP ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2008, : 53 - +
12345