Ultrasonic bonding method controlled by the characteristic waveform of ultrasonic propagation

被引:6
作者
Sun, Yibo [1 ,2 ]
Teng, Tiandong [1 ]
Guo, Guoqing [3 ]
Wu, Guoxiong [2 ]
机构
[1] Dalian Jiaotong Univ, Sch Locomot & Vehicle Engn, Dalian 116028, Peoples R China
[2] Suzhou Dongling Vibrat Test Instrument Co Ltd, Dalian, Peoples R China
[3] Shenyang Railway Signal Co Ltd, Shenyang, Liaoning, Peoples R China
基金
中国国家自然科学基金;
关键词
vibrations; wavelet transforms; ultrasonic propagation; polymers; ultrasonic bonding; frequency; 109375; 0 Hz to 125000; 0; Hz; node signal; vibration; ultrasonic precise bonding method; ultrasonic energy; ultrasonic bonding process; high-quality interfacial fusion bonding; characteristic point; ultrasonic bonding control procedure; characteristic waveform; interfacial fusion behaviour; wavelet packet decomposition; polymer components; ultrasonic horn;
D O I
10.1049/mnl.2018.5461
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The vibration propagated in polymer components is related to the interfacial fusion in ultrasonic bonding process, which can be employed to be reference variables to control the ultrasonic energy. In this paper, an ultrasonic precise bonding method controlled by characteristic waveform from the wavelet decomposition of the ultrasonic propagation is proposed. The vibration propagated from ultrasonic horn, through polymer components, to the anvil finally is analysed by wavelet packet decomposition. The node signal in the frequency band of 109,375-125,000 Hz, which contains more information related to the interfacial fusion behaviour, is reconstructed as the characteristic waveform. The ultrasonic bonding control procedure is designed by the recognition of two characteristic points on the characteristic waveform. Results indicate that, at the second characteristic point, high-quality interfacial fusion bonding is achieved without overflow out of the edge.
引用
收藏
页码:547 / 550
页数:4
相关论文
共 50 条
[31]   A Study on Flex-on-Fabric Interconnection Using Anisotropic Conductive Films and Ultrasonic Bonding Method [J].
Jung, Seung-Yoon ;
Hong, Hye-Eun ;
Paik, Kyung-Wook .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 7 (08) :1265-1271
[32]   Numerical Simulating Nonlinear Effects of Ultrasonic Propagation on High-speed Ultrasonic Gas Flow Measurement [J].
Li Yue-zhong ;
Wu Jiang-tao ;
Hu Kai-ming .
APPLIED MATHEMATICS & INFORMATION SCIENCES, 2013, 7 (05) :1963-1967
[33]   Influence of aggregates on ultrasonic elastic waves propagation in concrete [J].
Otsuki, N ;
Iwanami, M ;
Miyazato, S ;
Hara, N .
NON-DESTRUCTIVE TESTING IN CIVIL ENGINEERING 2000: SEIKEN SYMPOSIUM NO. 26, 2000, :313-322
[34]   Controlled Suppression of Wear on the Nanoscale by Ultrasonic Vibrations [J].
Pedraz, Patricia ;
Wannemacher, Reinhold ;
Gnecco, Enrico .
ACS NANO, 2015, 9 (09) :8859-8868
[35]   Effect of Contact Interface on Ultrasonic Characteristic of Wire Bond Transducer [J].
Li, Zhanhui ;
Wu, Yunxin ;
Long, Zhili .
MANUFACTURING ENGINEERING AND AUTOMATION I, PTS 1-3, 2011, 139-141 :2350-+
[36]   Surface Modification Effect on Ultrasonic Bonding for Aluminum Pad Arrays [J].
Li, Pin-Kuan ;
Fan, Yang-Chun ;
Chuang, Wallace ;
Schellkes, Eckart ;
Yasuda, Kiyokazu ;
Song, Jenn-Ming .
2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022), 2022, :13-14
[37]   Study on the Ultrasonic Bonding Process Using Molecular Dynamics Simulation [J].
Sasajima, Yasushi ;
Hatakeyama, Shingo ;
Iwamoto, Chihiro .
JOURNAL OF ELECTRONIC MATERIALS, 2025, 54 (03) :2423-2433
[38]   The design of a new ultrasonic horn for flip-chip bonding [J].
Wang, Wei-Chung ;
Chen, Shing ;
Liu, Chun-Hsien ;
Ni, Chun-Yao .
Experimental Mechanics in Nano and Biotechnology, Pts 1 and 2, 2006, 326-328 :505-508
[39]   Effects of Surface Physical Properties on Ultrasonic Cu/Cu Bonding [J].
Yu, I-You ;
Shih, Liang-Shing ;
Song, Jenn-Ming .
2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021), 2021, :23-24
[40]   Crystallographic observation for Au/Au bond interface by ultrasonic bonding [J].
Kyushu Institute of Technology, 1-1 Sensui-Cho, Tobata-Ku, Kitakyushu-Shi, Fukuoka 804-8550, Japan ;
不详 ;
不详 .
J. Jpn. Inst. Electron. Packag., 2009, 4 (307-312) :307-312