Constructing nickel chain/MXene networks in melamine foam towards phase change materials for thermal energy management and absorption-dominated electromagnetic interference shielding

被引:199
作者
Cheng, Haoran [1 ]
Xing, Linlong [1 ]
Zuo, Yang [1 ,2 ]
Pan, Yamin [1 ]
Huang, Mina [3 ]
Alhadhrami, A. [4 ]
Ibrahim, Mohamed M. [4 ]
El-Bahy, Zeinhom M. [5 ]
Liu, Chuntai [1 ]
Shen, Changyu [1 ]
Liu, Xianhu [1 ]
机构
[1] Zhengzhou Univ, Natl Engn Res Ctr Adv Polymer Proc Technol, Coll Mat Sci & Engn, Key Lab Adv Mat Proc & Mold,Minist Educ, Zhengzhou 450002, Peoples R China
[2] Beijing Spacecrafts Co Ltd, Beijing 100094, Peoples R China
[3] Taiyuan Univ Sci & Technol, Coll Mat Sci & Engn, Taiyuan 030024, Peoples R China
[4] Taif Univ, Coll Sci, Dept Chem, POB 11099, Taif 21944, Saudi Arabia
[5] Al Azhar Univ, Fac Sci, Dept Chem, Cairo 11884, Egypt
基金
国家重点研发计划; 中国国家自然科学基金;
关键词
Melamine foam; Phase change materials; EMI shielding; Thermal management; MICROWAVE-ABSORPTION; CHANGE COMPOSITES; HEAT DISSIPATION; CONDUCTIVITY; CARBON; CONVERSION; AEROGEL; FILMS; ENHANCEMENT; PERFORMANCE;
D O I
10.1007/s42114-022-00487-2
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Phase change materials (PCMs) are ideal for thermal management in miniaturized and integrated electronic devices. However, developing PCMs with efficient thermal management and electromagnetic interference (EMI) shielding has remained a challenge to keep up with the rapid evolution of precision electronics. Herein, melamine foam (MF) was used as a template to build a continuous thermal/conductive network by dip-coating magnetized nickel (Ni)/MXene (NiM), and then, polyethylene glycol (PEG) was encapsulated into porous NiM/MF hybrid sponge via vacuum impregnation method. With the synergistic effect of magnetic Ni chain and highly conductive MXene, the obtained NiM/PCM achieve suitable thermal conductivity (0.39 W/mk), high electrical conductivity (76.3 S/m), and excellent EMI shielding effectiveness (34.6 dB). In addition, the NiM/PCM endows outstanding thermal stability, durability, and high latent heat storage capabilities. This work provides new ideas and insights for the EMI shielding and temperature protection of future microelectronic devices.
引用
收藏
页码:755 / 765
页数:11
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