Development of a Ultra-Thin Glass Based Pressure Sensor for High-Temperature Application

被引:0
|
作者
Knoch, Philip [1 ]
Meier, Karsten [1 ]
Schulze, Robin [2 ]
Endisch, Christian [2 ]
Reichel, Ludwig [3 ]
Esche, Maria [4 ]
Bock, Karlheinz [1 ]
机构
[1] Tech Univ Dresden, Intitute Elect Packaging Technol, Dresden, Germany
[2] SITEC Ind GmbH, Chemnitz, Germany
[3] Sunfire GmbH, Dresden, Germany
[4] AdSphere GmbH, Dresden, Germany
来源
2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC | 2022年
关键词
ultra-thin glass; UTG; high temperature application; absolute pressure sensor; indium tin oxide; ITO;
D O I
10.1109/ESTC55720.2022.9939433
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, an ultra-thin glass substrate based absolute pressure sensor was developed and manufactured to study the implementation of different build-up technologies with focus on high-temperature sensor application. Physical vapour deposition was used to realise strain gauge sensor structures as well as several protective layers. Screen printed thick-film layers were applied to deposit routing traces. Also, a housing assembly using two ultra-thin glass substrates was achieved this way. The electrical connection to the measurement instrumentation was realised by either platinum or high purity nickel wires. Wires were connected to the contact pads by thick-film sintering. The measured overall thickness of the sensor is 390 mu m. Furthermore, the ultra-thin glass substrates were cut by Laser and saw dicing resulting in a recommendation to prefer Laser dicing for future work. To characterise the pressure sensor, a customised pressure chamber with integrated muffle furnace was used. First tests showed that the manufactured sensor proved to be functional at temperatures of up to 450 degrees C while applying a pressure range of 1 to 5 bar (absolute).
引用
收藏
页码:101 / 105
页数:5
相关论文
共 50 条
  • [1] Ultra-Thin Glass Based Temperature Sensor Package for High Temperature Applications
    Knoch, Philip
    Meier, Karsten
    Luniak, Marco
    Esche, Maria
    Bock, Karlheinz
    2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2020,
  • [2] High-temperature thermal sensor based on ultra-thin silicon film for ultra-low-power applications
    Li, B
    Wu, ZH
    Lai, PT
    Sin, JKO
    Liu, BY
    Zheng, XR
    SOLID-STATE ELECTRONICS, 2003, 47 (09) : 1553 - 1558
  • [3] FABRICATION OF ULTRA-THIN GLASS SHEET FOR ON-CHIP GLASS PRESSURE SENSOR
    Yuan, Yapeng
    Yalikun, Yaxiaer
    Shen, Yigang
    Tanaka, Yo
    2021 21ST INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), 2021, : 1259 - 1262
  • [4] Polysilicon thin film developed on ultra-thin flexible glass for temperature sensor
    Quintana, Juan M.
    Nguyen, Thinh H.
    Ahn, Chong H.
    2020 IEEE SENSORS, 2020,
  • [5] Effects of high-temperature annealing on ultra-thin CdTe solar cells
    Xia, Wei
    Lin, Hao
    Wu, Hsiang N.
    Tang, Ching W.
    THIN SOLID FILMS, 2011, 520 (01) : 563 - 568
  • [6] Development of high-temperature piezoresistive pressure sensor based silicon on insulator
    Pang Shixin
    Li Xin
    Liu Qin
    Xu Kaixian
    FIFTH INTERNATIONAL SYMPOSIUM ON INSTRUMENTATION SCIENCE AND TECHNOLOGY, 2009, 7133
  • [7] ELECTROPHYSICAL PARAMETERS OF SILICON SURFACE WITH HIGH-TEMPERATURE ULTRA-THIN THERMAL OXIDE
    MONAKHOV, VV
    ROMANOV, OV
    URITSKY, VY
    VESTNIK LENINGRADSKOGO UNIVERSITETA SERIYA FIZIKA KHIMIYA, 1986, (01): : 37 - 41
  • [8] Ultra-thin Co/Pd multilayers with enhanced high-temperature annealing stability
    Gottwald, M.
    Lee, K.
    Kan, J. J.
    Ocker, B.
    Wrona, J.
    Tibus, S.
    Langer, J.
    Kang, S. H.
    Fullerton, E. E.
    APPLIED PHYSICS LETTERS, 2013, 102 (05)
  • [9] Prototyping with Ultra-Thin Glass
    Pennetier, Sophie
    Stoddard, Josephine
    IASS 60TH ANNIVERSARY SYMPOSIUM (IASS SYMPOSIUM 2019) - 9TH INTERNATIONAL CONFERENCE ON TEXTILE COMPOSITES AND INFLATABLE STRUCTURES (STRUCTURAL MEMBRANES 2019), 2019, : 2212 - 2224
  • [10] Research of a Novel Ultra-High Pressure Sensor with High-Temperature Resistance
    Zhang, Guo-Dong
    Zhao, Yu-Long
    Zhao, Yun
    Wang, Xin-Chen
    Wei, Xue-Yong
    MICROMACHINES, 2018, 9 (01):