SYNTHESIS OF SILVER/COPPER NANOPARTICLES AND THEIR METAL-METAL BONDING PROPERTY

被引：12
|
作者：
Kobayashi, Y. [1 ]
Shirochi, T. [1 ]
Yasuda, Y. [2 ]
Morita, T. [2 ]
机构：
[1] Ibaraki Univ, Coll Engn, Dept Biomol Funct Engn, Hitachi, Ibaraki, Japan
[2] Hitachi Ltd, Hitachi Res Lab, Hitachi, Ibaraki, Japan
来源：
JOURNAL OF MINING AND METALLURGY SECTION B-METALLURGY | 2013年 / 49卷 / 01期
关键词：
Nanoparticles; Copper; Silver; Filler; Metal-metal bonding; TEMPERATURE; SILVER; AG;
D O I：
10.2298/JMMB120927025K
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
The present paper describes a metal-metal bonding technique using Cu nanoparticles containing Ag nanoparticles (Ag/Cu nanoparticles). The Ag/Cu nanoparticles with particle sizes of 30-85 nm and crystal sizes of 9.3 nm for Cu and 8.1 nm for Ag were produced by reducing 5.0x10(-3) M Ag+ (AgClO4) and 5.0x10(-3) M Cu2+ (Cu(NO3)(2)) simultaneously with 1.0 M hydrazine in aqueous solution containing 1.0 g/L poly(vinylpyrrolidone) as dispersing agent and 5x10(-3) M citric acid as stabilizer at room temperature. Discs of metallic Cu or metallic Ag were successfully bonded under annealing at 400 degrees C and pressurizing at 1.2 MPa for 5 min in H-2 gas with help of the Ag/Cu particles. The shear strengths required for separating the bonded discs were as large as 19.7 for the Cu discs and 16.0 MPa for the Ag discs
引用
收藏
页码：65 / 70
页数：6
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