SYNTHESIS OF SILVER/COPPER NANOPARTICLES AND THEIR METAL-METAL BONDING PROPERTY

被引：12

作者：

Kobayashi, Y. ^{[1
]}

Shirochi, T. ^{[1
]}

Yasuda, Y. ^{[2
]}

Morita, T. ^{[2
]}

机构：

[1] Ibaraki Univ, Coll Engn, Dept Biomol Funct Engn, Hitachi, Ibaraki, Japan

[2] Hitachi Ltd, Hitachi Res Lab, Hitachi, Ibaraki, Japan

来源：

JOURNAL OF MINING AND METALLURGY SECTION B-METALLURGY | 2013年 / 49卷 / 01期

关键词：

Nanoparticles; Copper; Silver; Filler; Metal-metal bonding; TEMPERATURE; SILVER; AG;

D O I：

10.2298/JMMB120927025K

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The present paper describes a metal-metal bonding technique using Cu nanoparticles containing Ag nanoparticles (Ag/Cu nanoparticles). The Ag/Cu nanoparticles with particle sizes of 30-85 nm and crystal sizes of 9.3 nm for Cu and 8.1 nm for Ag were produced by reducing 5.0x10(-3) M Ag+ (AgClO4) and 5.0x10(-3) M Cu2+ (Cu(NO3)(2)) simultaneously with 1.0 M hydrazine in aqueous solution containing 1.0 g/L poly(vinylpyrrolidone) as dispersing agent and 5x10(-3) M citric acid as stabilizer at room temperature. Discs of metallic Cu or metallic Ag were successfully bonded under annealing at 400 degrees C and pressurizing at 1.2 MPa for 5 min in H-2 gas with help of the Ag/Cu particles. The shear strengths required for separating the bonded discs were as large as 19.7 for the Cu discs and 16.0 MPa for the Ag discs

引用

页码：65 / 70

页数：6

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