A Centrifugal-Force-Assisted Wet-Etching Approach toward Top-Down Fabrication of Perovskite-Single-Crystalline Thin Films

Organic-inorganic hybrid halide perovskite-single-crystalline thin films with high quality are promising for making high-performance optoelectronic devices, but their fabrication is still challenging, particularly for the top-down fabrication. Here, a facile centrifugal-force-assisted wet-etching strategy is used in fabricating hybrid perovskite-single-crystalline thin film from its single-crystalline wafer. The film thickness can be reduced to less than 20 micrometres and the film remains high quality and flat surface. Besides, this method can be used to regenerate surface-metamorphic perovskite single crystals. The present technique may provide an effective strategy for single-crystalline thin film preparation for demanding device applications and it is expected that this strategy would promise high-efficient utilization of perovskite single crystals.