The heterogeneous integration of single-walled carbon nanotubes onto complementary metal oxide semiconductor circuitry for sensing applications

被引:18
作者
Chen, Chia-Ling [1 ]
Agarwal, Vinay [2 ]
Sonkusale, Sameer [2 ]
Dokmeci, Mehmet R. [1 ]
机构
[1] Northeastern Univ, Dept Elect & Comp Engn, NSF, Ctr High Rate Nanomfg, Boston, MA 02115 USA
[2] Tufts Univ, Dept Elect & Comp Engn, Medford, MA 02155 USA
基金
美国国家科学基金会;
关键词
FABRICATION;
D O I
10.1088/0957-4484/20/22/225302
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A simple methodology for integrating single-walled carbon nanotubes (SWNTs) onto complementary metal oxide semiconductor (CMOS) circuitry is presented. The SWNTs were incorporated onto the CMOS chip as the feedback resistor of a two-stage Miller compensated operational amplifier utilizing dielectrophoretic assembly. The measured electrical properties from the integrated SWNTs yield ohmic behavior with a two-terminal resistance of similar to 37.5 k Omega and the measured small signal ac gain (-2) from the inverting amplifier confirmed successful integration of carbon nanotubes onto the CMOS circuitry. Furthermore, the temperature response of the SWNTs integrated onto CMOS circuitry has been measured and had a thermal coefficient of resistance (TCR) of -0.4%. C-1. This methodology, demonstrated for the integration of SWNTs onto CMOS technology, is versatile, high yield and paves the way for the realization of novel miniature carbon-nanotube-based sensor systems.
引用
收藏
页数:6
相关论文
共 19 条
[1]  
[Anonymous], 1978, CAMBRIDGE MONOGRAPHS
[2]  
Chang L., 2004, MANAGE ACCOUNT RES, V15, P7, DOI [DOI 10.1016/J.MAR.2003.10.004, https://doi.org/10.1016/j.mar.2003.10.004]
[3]   Mechanical and electrical evaluation of parylene-C encapsulated carbon nanotube networks on a flexible substrate [J].
Chen, Chia-Ling ;
Lopez, Ernesto ;
Jung, Yung-Joon ;
Muftu, Sinan ;
Selvarasah, Selvapraba ;
Dokmeci, Mehmet R. .
APPLIED PHYSICS LETTERS, 2008, 93 (09)
[4]   A 1 GHz integrated circuit with carbon nanotube interconnects and silicon transistors [J].
Close, Gael F. ;
Yasuda, Shinichi ;
Paul, Bipul ;
Fujita, Shinobu ;
Wong, H. -S. Philip .
NANO LETTERS, 2008, 8 (02) :706-709
[5]   Nanowire nanosensors for highly sensitive and selective detection of biological and chemical species [J].
Cui, Y ;
Wei, QQ ;
Park, HK ;
Lieber, CM .
SCIENCE, 2001, 293 (5533) :1289-1292
[6]   Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's) [J].
Datta, M ;
Merritt, SA ;
Dagenais, M .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (02) :299-306
[7]   Dielectrophoretic batch fabrication of bundled carbon nanotube thermal sensors [J].
Fung, CMKM ;
Wong, VTS ;
Chan, RHM ;
Li, WJ .
IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2004, 3 (03) :395-403
[8]   Manipulation and trapping of sub-micron bioparticles using dielectrophoresis [J].
Green, NG ;
Morgan, H ;
Milner, JJ .
JOURNAL OF BIOCHEMICAL AND BIOPHYSICAL METHODS, 1997, 35 (02) :89-102
[9]   Dielectrophoretic assembly of electrically functional microwires from nanoparticle suspensions [J].
Hermanson, KD ;
Lumsdon, SO ;
Williams, JP ;
Kaler, EW ;
Velev, OD .
SCIENCE, 2001, 294 (5544) :1082-1086
[10]   Nanotransfer printing of organic and carbon nanotube thin-film transistors on plastic substrates [J].
Hines, DR ;
Mezhenny, S ;
Breban, M ;
Williams, ED ;
Ballarotto, VW ;
Esen, G ;
Southard, A ;
Fuhrer, MS .
APPLIED PHYSICS LETTERS, 2005, 86 (16) :1-3