Large-scale production of nano-twinned, ultrafine-grained copper

被引:80
作者
Hodge, A. M.
Wang, Y. M.
Barbee, T. W., Jr.
机构
[1] Lawrence Livermore Natl Lab, Mat Sci & Technol Div, Livermore, CA 94550 USA
[2] Lawrence Livermore Natl Lab, Nanoscale Synth & Characterizat Lab, Livermore, CA 94550 USA
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2006年 / 429卷 / 1-2期
关键词
ultrafine-grained copper; nano-twinned; multilayers; sputtering;
D O I
10.1016/j.msea.2006.05.109
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Large-scale production of high purity (99.999%), nano-twinned, and ultrafine-grained copper foils (22 mu m thick) was successfully implemented by the use of nanoscale multilayer technology. The process allows the production of up to fourteen 10 cm diameter foils during a single deposition run with high levels of reproducibility. Mechanical tests demonstrate that the strength of the Cu foils (alpha(y) similar to 540-690 MPa) compares favorably to ultratine-grained copper samples produced by other methods. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:272 / 276
页数:5
相关论文
共 26 条
  • [1] The influence of texture on the elastic properties of ultrafine-grain copper
    Agnew, SR
    Weertman, JR
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1998, 242 (1-2): : 174 - 180
  • [2] Microstructure and mechanical behavior of nanocrystalline metals
    Agnew, SR
    Elliott, BR
    Youngdahl, CJ
    Hemker, KJ
    Weertman, JR
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2000, 285 (1-2): : 391 - 396
  • [3] BARBEE TW, 1985, P TOP C LOW EN XRAY, P313
  • [4] BARBEE TW, 1980, P FALL M MET SOC AIM
  • [5] Tensile properties of in situ consolidated nanocrystalline Cu
    Cheng, S
    Ma, E
    Wang, YM
    Kecskes, LJ
    Youssef, KM
    Koch, CC
    Trociewitz, UP
    Han, K
    [J]. ACTA MATERIALIA, 2005, 53 (05) : 1521 - 1533
  • [6] COLUMNAR GRAINS AND TWINS IN HIGH-PURITY SPUTTER-DEPOSITED COPPER
    DAHLGREN, SD
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (04): : 832 - 836
  • [7] Microstructure/mechanical properties relationship in electrodeposited Ni/Cu nanolaminates
    Ebrahimi, F
    Liscano, AJ
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2001, 301 (01): : 23 - 34
  • [8] Mechanics of compressive stress evolution during thin film growth
    Guduru, PR
    Chason, E
    Freund, LB
    [J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2003, 51 (11-12) : 2127 - 2148
  • [9] Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers
    Huang, HB
    Spaepen, F
    [J]. ACTA MATERIALIA, 2000, 48 (12) : 3261 - 3269
  • [10] Mechanical behavior of nanocrystalline metals and alloys
    Kumar, KS
    Van Swygenhoven, H
    Suresh, S
    [J]. ACTA MATERIALIA, 2003, 51 (19) : 5743 - 5774