Microstructure evolution and mechanical properties of transient liquid phase bonded Ti-6Al-4V joint with copper interlayer

被引：43
作者：
Deng, Yongqiang [1 ]
Sheng, Guangmin [1 ]
Wang, Fangli [1 ]
Yuan, Xinjian [1 ]
An, Qi [1 ]
机构：
[1] Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
来源：
MATERIALS & DESIGN | 2016年 / 92卷
基金：
美国国家科学基金会;
关键词：
Ti-6Al-4V; Copper interlayer; Transient liquid phase bonding; Microstructure; Mechanical properties; WELD HEAT-TREATMENT; NOTCHED TENSILE FRACTURE; TITANIUM-ALLOYS; FATIGUE PROPERTIES; FILLER METALS; TI17; ALLOYS; STRENGTH; TI-15CU-15NI; TEMPERATURE; CP;
D O I：
10.1016/j.matdes.2015.11.103
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The microstructure evolution and mechanical properties of transient liquid phase bonded Ti-6Al-4V joint with copper interlayer was investigated by varying the bonding time at 930 degrees C. It was revealed that intensive metallurgical reactions occurred at the Ti-6Al-4V/Cu interface and integral joint consisting of TiCu, Ti2Cu layers and eutectoid structure was obtained for a bonding duration of 1 min. Prolonged holding time resulted in transformation of TiCu into Ti2Cu and subsequently progressive decomposition of the Ti2Cu phase. Ultimately, homogenized joint primarily composed of a -Ti matrix with tiny Ti2Cu platelets was obtained when bonding for 30 min. Tensile tests demonstrated that the homogenized joint exhibited mechanical properties comparable with that of the Ti-6Al-4V parent alloy. These experimental results demonstrate that the transient liquid phase bonding technique employing Cu interlayer is of great potential to be used for joining titanium based alloys. (C) 2015 Elsevier Ltd. All rights reserved.
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页码：1 / 7
页数：7
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