Advances in polymeric materials used for microelectronics packaging applications

被引：0
|
作者：
Wong, C. P. [1 ]
机构：
[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
来源：
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY | 2006年 / 231卷
关键词：
D O I：
暂无
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
484-PMSE
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页数：1
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