Orientation-specific fluidic self-assembly process based on a capillary effect

被引:15
作者
Lin, Cheng [1 ]
Tseng, Fan-Gang [1 ]
Chieng, Ching-Chang [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Engn & Syst Sci, Hsinchu 300, Taiwan
关键词
SEMICONDUCTOR-DEVICES; ALIGNMENT; FABRICATION; PAD;
D O I
10.1088/0960-1317/19/11/115020
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The investigation develops a novel design of a two-dimensional modified alignment mark of a tear-drop/elliptical hole with a tip angle of 60 degrees. TDE-1 and TDE-2 pattern shapes are adopted to increase the recovery angle and reduce the energy barrier to uni-directional micropart alignment. The results of the experimental and surface energy models are compared, both qualitatively and quantitatively, to examine the feasibility of the new design patterns. Experimental results reveal that the micropart of the TDE patterns can be accurately aligned by rotation through 90 degrees and a large capillary force. The acrylate adhesive force of the TDE-2 patterned micropart was estimated to be 41.2 +/- 10 mu N. Fluidic self-assembly (FSA) was performed in an aqueous environment, using a low-temperature solder or acrylate adhesive in part-substrate lubricant and template-assisted assembly. The standard deviation of the aligned angular orientation was 0.9 degrees and the lateral accuracy was 15 mu m; the re-aligned assembly yield was 100%. Micropart self-alignment with a unique in-plane orientation is achieved by exploiting shape recognition with the adhesive capillary effect.
引用
收藏
页数:12
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