Soft mold and gasbag pressure mechanism for patterning submicron patterns onto a large concave substrate

被引：21
作者：
Cheng, Fang-Sung
Yang, Sen-Yeu [1 ]
Nian, Shih-Chih
Wang, Lon A.
机构：
[1] Natl Taiwan Univ, Grace Lab Polymer Proc, Dept Mech Engn, Taipei 106, Taiwan
[2] Dahan Inst Technol, Dept Mech Engn, Taipei 106, Taiwan
[3] Natl Taiwan Univ, Dept Elect Engn, Taipei 106, Taiwan
[4] Natl Taiwan Univ, Grad Inst Electopt Engn, Taipei 106, Taiwan
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2006年 / 24卷 / 04期
关键词：
D O I：
10.1116/1.2209991
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A gasbag pressure (GBP) mechanism has been developed for patterning submicron patterns onto large concave substrate. The GBP mechanism consists of a pressure gasbag and a vacuum chamber system. It provides gradual contact, uniform pressure, and intact contact for imprinting patterns in the soft mold onto a concave substrate. The patterns on the soft mold can be successfully replicated over an entire photoresist-coated concave substrate. The accuracy of replication has been experimentally evaluated. (c) 2006 American Vacuum Society.
引用
收藏
页码：1724 / 1727
页数：4
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