Drain bias and position dependent performance degradation of dual-gate poly-Si TFTs with undoped region offsets

被引:3
作者
Hsu, Chih-Chieh [1 ,2 ]
Chen, Po-Tsung [2 ]
机构
[1] Natl Yunlin Univ Sci & Technol, Grad Sch Engn Sci & Technol, Touliu 64002, Yunlin, Taiwan
[2] Natl Yunlin Univ Sci & Technol, Grad Sch Elect Engn, Touliu 64002, Yunlin, Taiwan
关键词
polycrystalline silicon; thin film transistor (TFT); dual gate; electrical characteristics; THIN-FILM-TRANSISTOR; SIMULATION; SILICON;
D O I
10.1088/1361-6641/ab1a8f
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, electrical characteristics of dual-gate polycrystalline silicon (poly-Si) thin film transistors (TFTs) with different undoped region (UR) offsets are investigated. Performance degradation of the poly-Si TFT is dependent on the offset value, offset direction, and offset location. In addition, the degradation is also dependent on the applied drain bias. Significant performance deterioration is observed when the offset is larger than +/- 0.4 mu m. Even an offset in an individual UR can cause the degradation. At a low drain bias of -0.1 V, the degradation is independent on the direction and the location of the offset. When the drain bias increases to -10 V, the performance degradation of the TFT with the positive UR offset significantly reduces. The physical mechanisms underlying the performance variation are studied by analyzing the energy band diagrams, carrier concentration distributions, and electric field distributions.
引用
收藏
页数:10
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共 40 条
  • [1] Ashitomi T, 2017, J INFORM DISPLAY, V18, P185, DOI 10.1080/15980316.2017.1381650
  • [2] TCAD Simulation of Dual-Gate a-IGZO TFTs With Source and Drain Offsets
    Billah, Mohammad Masum
    Hasan, Md Mehedi
    Chun, Minkyu
    Jang, Jin
    [J]. IEEE ELECTRON DEVICE LETTERS, 2016, 37 (11) : 1442 - 1445
  • [3] Electrical properties of in-plane-implanted graphite nanoribbons
    Camargo, B. C.
    de Jesus, R. F.
    Semenenko, B. V.
    Precker, C. E.
    [J]. JOURNAL OF APPLIED PHYSICS, 2017, 122 (24)
  • [4] Reliability of Polycrystalline Silicon Thin-Film Transistors on the glass substrate
    Choi, Sung-Hwan
    Han, Min-Koo
    [J]. THIN FILM TRANSISTORS 10 (TFT 10), 2010, 33 (05): : 41 - 49
  • [5] Doping fin field-effect transistor sidewalls: Impurity dose retention in silicon due to high angle incident ion implants and the impact on device performance
    Duffy, R.
    Curatola, G.
    Pawlak, B. J.
    Doornbos, G.
    van der Tak, K.
    Breimer, P.
    van Berkum, J. G. M.
    Roozeboom, F.
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2008, 26 (01): : 402 - 407
  • [6] The Effects of Offset Spacer on nMOSFET Hot-Carrier Lifetime
    Feng, Junhong
    Gan, Zhenghao
    Zhang, Lifei
    Chang, Lifu
    Pan, Zicheng
    Shi, Xuejie
    Wu, Hong
    Ye, Bin
    Yu, Tzu Chiang
    [J]. CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012, 44 (01): : 135 - 139
  • [7] Lateral ion implant straggle and mask proximity effect
    Hook, TB
    Brown, J
    Cottrell, P
    Adler, E
    Hoyniak, D
    Johnson, J
    Mann, R
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (09) : 1946 - 1951
  • [8] Effects of Parasitic Source/Drain Field Plates on Performances of Channel-Passivated Amorphous InGaZnO Thin-Film Transistors
    Hsu, Chih-Chieh
    Huang, Po-Hao
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 65 (11) : 4868 - 4874
  • [9] A Hybrid Wide Drain Poly-Si FinTFT for RF Application
    Hu, Hsin-Hui
    Cheng, Han-Yang
    [J]. IEEE ACCESS, 2018, 6 : 47268 - 47272
  • [10] Hung-Chien L, 2011, J PHYS D, V44