Effect of nano α-Fe2O3 additions on physical and mechanical properties of Sn-1.0Ag-0.7Cu-xFe2O3 low Ag lead-free solders

被引:17
|
作者
Chen, Ping [1 ]
Zhao, Xiuchen [1 ]
Wang, Yong [1 ,2 ]
Zheng, Bing [1 ]
Liu, Chengliang [1 ]
Chen, Siqi [1 ]
机构
[1] Beijing Inst Technol, Sch Mat Sci & Engn, 5 Yard,Zhong Guan Cun South St, Beijing 100081, Peoples R China
[2] Beijing Microelect Technol Inst, Beijing 100076, Peoples R China
关键词
CU SOLDER; TIO2; NANOPARTICLES; MICROSTRUCTURE; JOINTS; WETTABILITY; GROWTH; MICROHARDNESS; PARTICLES;
D O I
10.1007/s10854-015-3918-y
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, the alpha-Fe2O3 nanoparticles were successfully fabricated by chemical method. Smelting technique has been used to prepare the Sn-1.0Ag-0.7Cu-xFe(2)O(3) composite solders, while the weight percent of alpha-Fe2O3 in the solders ranged from 0 to 1 wt%. The influences of alpha-Fe2O3 nanoparticles on microstructure, melting temperature, microhardness, and coefficient of thermal expansion (CTE) of the composite solders and on mechanical properties of the composite solders joints were investigated. The results indicate that added alpha-Fe2O3 nanoparticles can remarkably improve the Vickers microhardness of the composite solders and decrease the CTE of composite solders, while the melting temperature of the composite solders have no obvious change, compared to the original Sn-1.0Ag-0.7Cu solder. The shear strength and tensile strength of the solder joints will be increased firstly and then decreased with the increasing of alpha-Fe2O3 in the composite solders. And the Sn-1.0Ag-0.7Cu-0.4Fe(2)O(3) solder joint possesses the best shear strength and tensile strength.
引用
收藏
页码:1507 / 1519
页数:13
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