Compact Modeling of Signal Transients and Integrity Analysis for Dispersionless Interconnect

被引：0
|
作者：
Zhao, Wei [1 ]
Liu, Chi [1 ]
Wu, Wen [1 ]
Ma, Yong [1 ]
Zhao, Xiaojin [1 ]
Cao, Yu [1 ]
Wang, Guozeng [1 ]
He, Jin [1 ]
机构：
[1] Peking Univ, Shenzhen SOC Key Lab, PKU HKUST Shenzhen Inst, IER, Hitech Ind Pk South, Shenzhen 518057, Peoples R China
来源：
NANOTECHNOLOGY 2011: ELECTRONICS, DEVICES, FABRICATION, MEMS, FLUIDICS AND COMPUTATIONAL, NSTI-NANOTECH 2011, VOL 2 | 2011年
关键词：
interconnect; dispersionless; compact modeling; transients; signal integrity and transmission line theory;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, a compact model for transient response of the dispersionless interconnects is rigorously derived with resistive, inductive and capacitive load terminations. The proposed compact models are verified by the HSPICE simulation result to be highly accurate. And the analysis of signal integrity such as delay and noise for the dispersionless interconnect is also demonstrated by the mans of the developed compact model.
引用
收藏
页码：686 / 689
页数：4
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