Joining silicon nitride ceramic using a composite powder as active brazing alloy

被引:51
作者
Brochu, M
Pugh, MD
Drew, RAL
机构
[1] McGill Univ, Dept Min Met & Mat Engn, Montreal, PQ H3A 2B2, Canada
[2] Concordia Univ, Montreal, PQ H3G 1M8, Canada
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2004年 / 374卷 / 1-2期
关键词
brazing; silicon nitride; Cu-Ti alloy; reaction layer;
D O I
10.1016/j.msea.2003.10.276
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The aim of this study was to join silicon nitride ceramic using a Cu-Ti bi-metallic composite powder. The microstructure and mechanical properties obtained were similar to results obtained with conventional active brazing alloys but with different kinetics. The experimental results obtained show the potential in using the composite powder as a brazing alloy. The reaction layer produced at the ceramic/filler metal interface was composed mainly of TiN and Ti5Si3. Similar to many active ceramic brazing processes, the reaction layer was formed in two stages, where the initial step was controlled by a liquid/solid reaction, followed by diffusion controlled growth. Depending on the brazing parameter, the reaction layer thickness ranged between 4 and 12 mum. Reaction layer growth was modeled and the effective activation energy was found to be 64 kJ/mole. The four-point bending strength varied between 250 and 400 MPa, depending on joining conditions. The crack propagation mode was through the interface for low strength joints and through the ceramic for high strength joints. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:34 / 42
页数:9
相关论文
共 15 条
  • [1] [Anonymous], 1998, JOINING PROCESSES IN
  • [2] *AWSM INT MAT PARK, 1994, ASME HDB PHAS DIAGR, V3
  • [3] Brochu M., 2002, Ceramic Engineering and Science Proceedings, V23, P801
  • [4] BROCHU M, IN PRESS MAT SCI ENG
  • [5] CAWLEY JD, 1991, METAL-CERAMIC JOINING, P3
  • [6] Fernie JA, 1999, IND CERAM, V19, P172
  • [7] THE WETTING, REACTION AND BONDING OF SILICON-NITRIDE BY CU-TI ALLOYS
    KIM, DH
    HWANG, SH
    CHUN, SS
    [J]. JOURNAL OF MATERIALS SCIENCE, 1991, 26 (12) : 3223 - 3234
  • [8] REACTION LAYER FORMATION IN NITRIDE CERAMICS (SI3N4 AND AIN) TO METAL JOINTS BONDED WITH ACTIVE FILLER METALS
    NAKAO, Y
    NISHIMOTO, K
    SAIDA, K
    [J]. ISIJ INTERNATIONAL, 1990, 30 (12) : 1142 - 1150
  • [9] NICHOLAS MG, 1988, MATER SCI FORUM, V29, P127
  • [10] PALIT D, 2003, P IBSC 2003 SAN DIEG