Multi-GHZ Modeling and Characterization of On-Chip Power Delivery Network

被引：0

作者：

Pandit, Vishram S. ^{[1
]}

Ryu, Woong Hwan ^{[1
]}

机构：

[1] Intel Corp, Folsom, CA 95630 USA

来源：

2008 IEEE-EPEP ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

On-chip PDN consists of power grid and the intentional decap. In this paper, we demonstrate a technique to determine the on-chip PDN model for a chipset. 2D TLM approach can be used up-to several GHz.

引用

页码：105 / 108

页数：4