Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates

被引：5
|
作者：
Fan, Xuanqing [1 ]
Wang, Yi [2 ]
Li, Yuhang [1 ,2 ]
Fu, Haoran [3 ]
机构：
[1] Beihang Univ BUAA, Inst Solid Mech, Beijing 100191, Peoples R China
[2] Beihang Univ, Ningbo Inst Technol, Aircraft & Prop Lab, Ningbo 315800, Peoples R China
[3] Inst Flexible Elect Technol THU Zhejiang, Frontier Res Ctr, Jiaxing 314006, Peoples R China
来源：
SENSORS | 2020年 / 20卷 / 18期
基金：
中国国家自然科学基金;
关键词：
post-buckling; free vibration; thin film; elastic substrate; flexible electronics; BEAMS; SKIN; ELECTRONICS; SILICON;
D O I：
10.3390/s20185425
中图分类号：
O65 [分析化学];
学科分类号：
070302 ; 081704 ;
摘要：
Buckling stability of thin films on compliant substrates is universal and essential in stretchable electronics. The dynamic behaviors of this special system are unavoidable when the stretchable electronics are in real applications. In this paper, an analytical model is established to investigate the vibration of post-buckled thin films on a compliant substrate by accounting for the substrate as an elastic foundation. The analytical predictions of natural frequencies and vibration modes of the system are systematically investigated. The results may serve as guidance for the dynamic design of the thin film on compliant substrates to avoid resonance in the noise environment.
引用
收藏
页码：1 / 12
页数：12
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