Edge cracking behavior of Y2O3 coatings by the solution deposition planarization method

As an efficient flattening technique for surface smoothing, solution deposition planarization (SDP) has recently drawn more attention as a fabrication method for second generation high temperature superconducting (2GHTS) tapes. However, at present, it is still challenging to achieve edge crack-free surfaces while preparing a Y2O3 coating via SDP processing, especially during drying and heat treatment. Experimental results show that as the colloidal dispersion is coated and dried on a nonporous rigid substrate, the enormous stresses developed during the drying process can fracture the thin film. The finite element simulation results show that coating thickness, which is affected by the differences in pulling rate and solution concentration, is a critical factor determining the crack sies may be initiated. After optimizing the coating parameters, a 10-m long Hastelloy C-276 alloy base was successfully prepared. The average value of Ra was 1.28 nm, which is less than 5 nm (5 x 5 mu m2), satisfying the industrial requirements for the preparation of superconducting materials using the IBAD (lon Beam Assisted Deposition) technology route.