Thermal Conductivity and Dilatation of Bi-2223/Ag (DI-BSCCO) Superconducting Wire Laminated With Various Thin Alloy Tapes

被引：5
作者：
Naito, Tomoyuki [1 ]
Fujishiro, Hiroyuki [1 ]
Yamada, Yuichi [2 ]
机构：
[1] Iwate Univ, Fac Sci & Engn, Morioka, Iwate 0208551, Japan
[2] Sumitomo Elect Ind Ltd, Superconduct Technol Div, Osaka 5540024, Japan
来源：
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 2018年 / 28卷 / 04期
关键词：
Bi-2223/Ag tape; thermal conductivity; thermal dilatation;
D O I：
10.1109/TASC.2018.2796382
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A Bi-2223/Ag wire laminated with Ni-alloy tapes offered the high critical tensile strength over 400 MPa with a high critical current of about 200 A, which has just started to be equipped in high-field facilities. To design such a practical super-conducting apparatus, we must know the heat leakage through the wires and the elasticity among the constitutional materials. In this paper, we report on the thermal conductivity and dilatation of this new Bi-2223/Ag/Ni-alloy tape, compared to those of other Bi-2223/Ag tapes, and discuss the contribution of the lamination alloy to the thermal properties.
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页数：4
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