Analysis on the cracking of thin hard films considering the effects of interfacial delamination

被引：11

作者：

Shu, Kun ^{[1
]}

Zhang, Chuanwei ^{[1
]}

Zheng, Dezhi ^{[1
]}

Cui, Shuhui ^{[1
]}

Hou, Pingping ^{[1
]}

Gu, Le ^{[1
]}

机构：

[1] Harbin Inst Technol, MIIT Key Lab Aerosp Bearing Technol & Equipment, Harbin 150001, Peoples R China

来源：

SURFACE & COATINGS TECHNOLOGY | 2020年 / 402卷

基金：

中国国家自然科学基金;

关键词：

Thin hard film; Cracking; Delamination; Extended finite element method; Cohesive zone model; BRITTLE COATINGS; INDENTATION; DIAMOND; PERFORMANCE; MECHANICS; FRACTURE; SYSTEMS; DAMAGE;

D O I：

10.1016/j.surfcoat.2020.126284

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Cracking of thin hard films on ductile substrates under indentation was investigated considering the effects of interfacial delamination. The fracture behavior of the film was analyzed using the extended finite element method (XFEM), and the evolution of the interfacial delamination was simulated using a cohesive zone model (CZM). Results showed that at the location within the contact area, interfacial delamination hastened the cracking at the bottom surface of the film because of the enhancement of the film stretching. However, at the location outside the contact area, the cracking on the top surface of the film was postponed by the interfacial delamination due to the reduction in the film bending. The interfacial strength and toughness had significant effects on the delamination evolution at film/substrate interfaces, and therefore strongly affected the cracking behavior of thin hard films.

引用

页数：11

共 23 条

[1] Numerical analysis of indentation-induced cracking of brittle coatings on ductile substrates [J].