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- [2] Effect of Ar Reflow Atmosphere on the SAC305 Solder Joint Reliability 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 945 - 948
- [3] A Comparison of the Creep Behavior of Joint-Scale SAC105 and SAC305 Solder Alloys IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (03): : 516 - 527
- [4] Effect of Ni Nanoparticles on Intermetallic Compounds Formation in SAC305 Solder Joint under High Current Density 2014 IEEE 36TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2015,
- [6] Effect of Isothermal Aging and Copper Substrate Roughness on the SAC305 Solder Joint Intermetallic Layer Growth of High Temperature Storage (HTS) SAINS MALAYSIANA, 2020, 49 (12): : 3045 - 3054