Electromagnetic Field Analysis with Advanced Structural Modeling of Microstrips on Porosified LTCC

被引:0
作者
Talai, Armin [1 ]
Weigel, Robert [1 ]
Koelpin, Alexander [1 ]
Gmeiner, Bjoern [2 ]
Ruede, Ulrich [2 ]
Steinhaeusser, Frank [3 ]
Bittner, Achim [3 ]
Schmid, Ulrich [3 ]
机构
[1] Univ Erlangen Nurnberg, Inst Elect Engn, Cauerstr 9, D-91058 Erlangen, Germany
[2] Friedrich Alexander Univ, Dept Comp Sci, D-91058 Erlangen, Germany
[3] Vienna Univ Technol, Inst Sensor & Actuator Syst, A-1040 Vienna, Austria
来源
2013 EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2013年
关键词
Field simulation; structural modeling; LTCC; reduction of permittivity; porosification; inhomogeneous substrate;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Recent investigations demonstrated that porosification offers the possibility of high quality antenna integration on LTCC by local reduction of the relative permittivity. In order to take advantage of this technology, further research for the deposition of conductors on porosified areas has to be done. Since the near-surface material removal is strong, conductors are expected to penetrate substantially into the porosified substrate. In this paper a new, randomized structural modeling technique of porosified LTCC is presented, which is based on scanning electron microscope imaging. Finite 3D field simulations, performed with this model, show the electromagnetic effects of different vertical microstrip positions on the effective permittivity and the corresponding scattering parameters.
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收藏
页码:440 / 443
页数:4
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