Micromachined chip-scale plasma light source

被引：10

作者：

Carazzetti, P. ^{[1
]}

Renaud, Ph. ^{[1
]}

Shea, H. ^{[1
]}

机构：

[1] Ecole Polytech Fed Lausanne, CH-1015 Lausanne, Switzerland

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2009年 / 154卷 / 02期

关键词：

Plasma; Interdigitated electrodes; Anodic bonding; Hermetic sealing; Light source; Impedance matching; Spectroscopy; Micromachining; Aluminum electrodes; STRUCTURED ELECTRODE ARRAYS; ELECTRICAL BREAKDOWN; ATMOSPHERIC-PRESSURE; FIELD BREAKDOWN; DEVICES; TECHNOLOGY; DISCHARGES; AIR;

D O I：

10.1016/j.sna.2008.05.028

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We report on the microfabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity containing interdigitated Aluminum electrodes. When the electrodes are powered through an impedance matching circuit, these devices have been used to generate stable millimeter-size RF plasma discharges operating continuously for over 24 h in He or At at pressures ranging from 10 to 500 mbar at RF powers of 300-1500 mW. (C) 2008 Elsevier B.V. All rights reserved.

引用

页码：275 / 280

页数：6