Research of Silver Sintering Process and Reliability for High Temperature Operation of SiC Power Devices

被引：0
作者：
Zhang, Z. [1 ]
Hanada, T. [1 ]
Nakamura, T. [1 ]
机构：
[1] ROHM Co Ltd, Kyoto, Japan
来源：
SILICON CARBIDE AND RELATED MATERIALS 2013, PTS 1 AND 2 | 2014年 / 778-780卷
关键词：
silver paste; sintering; die attachment;
D O I：
10.4028/www.scientific.net/MSF.778-780.1114
中图分类号：
O7 [晶体学];
学科分类号：
0702 ; 070205 ; 0703 ; 080501 ;
摘要：
In order to take full advantage of the high power density available by the packaging of SiC devices, this group has been exploring die attachment methods based on the sintering of silver particles between the device and silver-plated Cu substrates with void free results. We have also extended this capability from not only attaching single chips assembled in TO-247 packages but also to multiple chips attached at once on a copper substrate. This multi-chip processing capability will aid in further development of SiC power modules.
引用
收藏
页码：1114 / 1117
页数：4
相关论文
共 50 条
  • [21] Nano-Cu Sintering Paste for High Power Devices Die Attach Applications
    Zhao, Jinjin
    Yao, Min
    Lee, Ning-Cheng
    2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 557 - 563
  • [22] Nano-Cu Sintering Paste for High Power Devices Die Attach Applications
    Zhao, Jinjin
    Yao, Min
    Lee, Ning-Cheng
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 1693 - 1699
  • [23] Nano-Cu Sintering Paste for High Power Devices Die Attach Applications
    Zhao, Jinjin
    Yao, Min
    Lee, Ning-Cheng
    2017 12TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2017, : 70 - 76
  • [24] Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range
    Tanimoto, Satoshi
    Matsui, Kohei
    Zushi, Yusuke
    Sato, Shinji
    Murakami, Yoshinori
    Takamori, Masato
    Iseki, Takashi
    SILICON CARBIDE AND RELATED MATERIALS 2011, PTS 1 AND 2, 2012, 717-720 : 853 - 856
  • [25] A Review of Binderless Polycrystalline Diamonds: Focus on the High-Pressure-High-Temperature Sintering Process
    Guignard, Jeremy
    Prakasam, Mythili
    Largeteau, Alain
    MATERIALS, 2022, 15 (06)
  • [26] Sintering Manufacture Process Research on Special Ceramics Fe-Si3N4 Bonded SiC
    PENG Dayan and ZHANG Yong(Central Iron & Steel Research Institute Beijing
    China's Refractories, 2003, (02) : 23 - 25
  • [27] Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature
    Li, Dan
    Mei, Yunhui
    Xin, Yunchang
    Li, Zhiqiao
    Chu, Paul K.
    Ma, Changsheng
    Lu, Guo-Quan
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2020, 35 (12) : 12646 - 12650
  • [28] Liquid-phase sintering from the high-temperature corrosion process standpoint
    Medvedovski, E
    MATERIALS CHEMISTRY AND PHYSICS, 2001, 67 (1-3) : 32 - 36
  • [29] Reliability Analysis of Large-Area, Low-Pressure-Assisted Silver Sintering for Medium-Voltage Power Modules
    Gersh, Jacob
    DiMarino, Christina
    DeVoto, Douglas
    Paret, Paul P.
    Major, Joshua
    IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2022, 10 (05) : 5252 - 5259
  • [30] Die-bonding performance and mechanism based on the sintering of micro Ag paste for high power devices
    Takemasa, Tetsu
    Ueshima, Minoru
    Jiu, Jinting
    Suganuma, Katsuaki
    2016 IEEE 16TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO), 2016, : 377 - 380
12345