Research of Silver Sintering Process and Reliability for High Temperature Operation of SiC Power Devices

被引：0
作者：
Zhang, Z. [1 ]
Hanada, T. [1 ]
Nakamura, T. [1 ]
机构：
[1] ROHM Co Ltd, Kyoto, Japan
来源：
SILICON CARBIDE AND RELATED MATERIALS 2013, PTS 1 AND 2 | 2014年 / 778-780卷
关键词：
silver paste; sintering; die attachment;
D O I：
10.4028/www.scientific.net/MSF.778-780.1114
中图分类号：
O7 [晶体学];
学科分类号：
0702 ; 070205 ; 0703 ; 080501 ;
摘要：
In order to take full advantage of the high power density available by the packaging of SiC devices, this group has been exploring die attachment methods based on the sintering of silver particles between the device and silver-plated Cu substrates with void free results. We have also extended this capability from not only attaching single chips assembled in TO-247 packages but also to multiple chips attached at once on a copper substrate. This multi-chip processing capability will aid in further development of SiC power modules.
引用
收藏
页码：1114 / 1117
页数：4
相关论文
共 50 条
  • [1] High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment
    Bai, John Guofeng
    Yin, Ran
    Zhang, Zhiye
    Lu, Guo-Quan
    van Wyk, Jacobus Daniel
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (03): : 506 - 510
  • [2] Effect of Ag Sintered Bondline Thickness on High-Temperature Reliability of SiC Power Devices
    Deng, Zhongyang
    Zou, Guisheng
    Jia, Qiang
    Feng, Bin
    Zhang, Hongqiang
    Ren, Hui
    Liu, Lei
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (11): : 1889 - 1895
  • [3] Nanoscale silver sintering for high-temperature packaging of semiconductor devices
    Zhang, ZY
    Calata, JN
    Bai, JG
    Lu, GQ
    SURFACES AND INTERFACES IN NANOSTRUCTURED MATERIALS AND TRENDS IN LIGA, MINIATURIZATION, AND NANOSCALE MATERIALS, 2004, : 129 - 135
  • [4] Research on the Key Processes of Large-Area Silver Sintering for SiC Power Modules
    Chang, Guiqin
    An, Di
    Deng, Erping
    Li, Xiang
    Luo, Haihui
    Huang, Yongzhang
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2025, 15 (02): : 410 - 420
  • [5] Silver Sintering on Organic Substrates for the Embedding of Power Semiconductor Devices
    Schiffmacher, Alexander
    Litzenberger, Lorenz
    Wilde, Juergen
    Huesgen, Till
    Polezhaev, Vladimir
    2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 1443 - 1450
  • [6] Reliability of sintered Ag80-Al20 die attach nanopaste for high temperature applications on SiC power devices
    Manikam, Vernal Raja
    Razak, Khairunisak Abdul
    Cheong, Kuan Yew
    MICROELECTRONICS RELIABILITY, 2013, 53 (03) : 473 - 480
  • [7] Low-Temperature Bonding Process by Silver Nanoparticles Paste for Power Electronic Devices
    Fang, Yu-Chi
    Wang, Yu-Chieh
    Ouyang, Fan-Yi
    JOURNAL OF ELECTRONIC MATERIALS, 2023, 52 (02) : 792 - 800
  • [8] Low-Temperature Bonding Process by Silver Nanoparticles Paste for Power Electronic Devices
    Yu-Chi Fang
    Yu-Chieh Wang
    Fan-Yi Ouyang
    Journal of Electronic Materials, 2023, 52 : 792 - 800
  • [9] Sintering of SiC enhanced copper paste for high power applications
    Gutierrez, Marti
    Wang, Nan
    Samani, Majid Kabiri
    Ye, Lilei
    Liu, Johan
    2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017, : 151 - 156
  • [10] A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices
    Chin, Hui Shun
    Cheong, Kuan Yew
    Ismail, Ahmad Badri
    METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE, 2010, 41 (04): : 824 - 832
12345