Significant enhancement of bond strength in the accumulative roll bonding process using nano-sized SiO2 particles

被引：123

作者：

Lu, Cheng ^{[1
]}

Tieu, Kiet ^{[1
]}

Wexler, David ^{[1
]}

机构：

[1] Univ Wollongong, Sch Mech Mat & Mechatron Engn, Wollongong, NSW 2522, Australia

来源：

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2009年 / 209卷 / 10期

关键词：

Accumulative roll bonding; Nano-sized SiO2 particle; Bond strength; Ultrafine grained material; ARB PROCESS; MECHANICAL-PROPERTIES; IF-STEEL; PLASTIC-DEFORMATION; GRAIN-REFINEMENT; EVOLUTION; ALUMINUM; ALLOY; AL;

D O I：

10.1016/j.jmatprotec.2009.01.003

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Accumulative roll bonding (ARB) is one of the most promising methods for the industrial production of ultrafine grained (UFG) sheet materials. The poor bond strength is one of the major drawbacks in the ARB process. Degreasing and wire-brushing have been widely adopted in ARB to improve bonding. In this paper, the nano-sized SiO2 particles has been used to enhance the bond strength. The bond strength in our samples exceeds 2.5 times the values achieved by degreasing and wire-brushing methods. In addition, the mechanical properties and microstructures of the ARB-processed samples have also been investigated. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：4830 / 4834

页数：5

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