Relating sinusoid to random vibration for electronic packaging testing

被引：3

作者：

Wang, FF ^{[1
]}

机构：

[1] Eldec Co, Lynnwood, WA 98046 USA

来源：

ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS | 2002年

关键词：

reliability; test; vibration; sine sweep; sine dwell; sinusoid vibration; random vibration;

D O I：

10.1109/ITHERM.2002.1012549

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

There are two acceptable exercises of evaluating the electronics against vibration damage. They are sinusoid vibration, and random vibration testing. The differences of these two tests are obvious. Their characterizations of vibration are based on distinctly different sets of mathematics. This paper will discuss a method to relate one testing result to the other. The method to relate these two testing methods is based on the equivalent damage theory of the electronics packaging. The theory is that if one testing method causes the same kinds of damaging effects as the other testing method, the results can then be related.

引用

页码：892 / 895

页数：4